Patents by Inventor Hsi-Yi Chen

Hsi-Yi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072411
    Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Applicant: Pegatron Corporation
    Inventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chia-Hung Chen, Chen-Kuang Wang, Wen-Hgin Chuang, Chia-Hong Chen, Hsi Yung Chen
  • Publication number: 20080268107
    Abstract: A container includes a housing having a chamber formed by a peripheral wall for receiving a beverage or food, and a heat medium reservoir for receiving a heat medium and a control valve device for selectively releasing the heat medium from the heat medium reservoir into the chamber of the housing and for preserving the beverage or food contained within the housing. The heat medium may be selected from a liquid nitrogen, a gaseous nitrogen, a coolant, or a carbon dioxide. The housing may include an orifice for coupling to a hose which is coupled to the heat medium reservoir for supplying the heat medium into the chamber of the housing.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventor: Hsi-Yi Chen