Patents by Inventor Hsia-Wei Liu

Hsia-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240114810
    Abstract: A semiconductor structure includes: an etch-stop dielectric layer overlying a substrate and including a first opening therethrough; a silicon oxide plate overlying the etch-stop dielectric layer and including a second opening therethrough; a first conductive structure including a first electrode and extending through the second opening and the first opening; a memory film contacting a top surface of the first conductive structure and including a material that provides at least two resistive states having different electrical resistivity; and a second conductive structure including a second electrode and contacting a top surface of the memory film.
    Type: Application
    Filed: April 20, 2023
    Publication date: April 4, 2024
    Inventors: Fu-Ting Sung, Jhih-Bin Chen, Hung-Shu Huang, Hong Ming Liu, Hsia-Wei Chen, Yu-Wen Liao, Wen-Ting Chu
  • Publication number: 20140199349
    Abstract: Disclosed is a pH-sensitive hyaluronic acid derivative, comprising at least one repeat unit as shown in the following formula (I), wherein HA represents a unit comprising N-acetyl-D-glucosamine and D-glucuronic acid, q represents an integer of 2 to 10,000; A represents a biocleavable linkage comprising at least one of hydrazone, acetal, ketal and imine; M represents at least one of a hydrophobic fragment, a hydrophilic fragment, and an amphiphilic fragment, and p represents the number of [A-M] directly grafted onto each HA unit, p represents an integer of 0 to 4, and the p of each HA unit is not 0 at the same time.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 17, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jean-Dean Yang, Ayi-Man Chou, Jui-Hsiang Chen, Hsia-Wei Liu, Shian-Jy Wang, Tse-Min Teng, Hsiang-Fa Liang, Ming-Cheng Wei, Maggie J.M. Lu