Patents by Inventor Hsian Pang Kuah

Hsian Pang Kuah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inverted lead frame in substrate
    Patent number: 7642638
    Abstract: A semiconductor package, and method of making a semiconductor package, with a plurality of dies, wherein one die is attached to an inverted lead frame and another die is attached to a substrate. The leadframe is then attached to the substrate. More specifically, the semiconductor package includes a substrate, a lead frame and a plurality of leads. The lead frame is attached to the top surface of the substrate. The bottom surface of a first die is attached to the top surface of the substrate and the first die is electrically connected to the substrate. The top surface of a second die is attached to the bottom die pad surface of the lead frame and the second die is electrically connected to the leadframe. An encapsulant covers at least a portion of the lead frame and substrate.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: January 5, 2010
    Assignee: United Test And Assembly Center Ltd.
    Inventors: Hsian Pang Kuah, Jenny Phua
  • INVERTED LF IN SUBSTRATE
    Publication number: 20080150106
    Abstract: A semiconductor package, and method of making a semiconductor package, with a plurality of dies, wherein one die is attached to an inverted lead frame and another die is attached to a substrate. The leadframe is then attached to the substrate. More specifically, the semiconductor package includes a substrate, a lead frame and a plurality of leads. The lead frame is attached to the top surface of the substrate. The bottom surface of a first die is attached to the top surface of the substrate and the first die is electrically connected to the substrate. The top surface of a second die is attached to the bottom die pad surface of the lead frame and the second die is electrically connected to the leadframe. An encapsulant covers at least a portion of the lead frame and substrate.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 26, 2008
    Applicant: United Test and Assembly Center, Ltd.
    Inventors: Hsian Pang Kuah, Jenny Phua