Abstract: A processor card has a connector for plugging into a processor slot, signal switching circuitry electrically connected to the connector, power switching circuitry for controlling power to the processor card and a processor electrically connected to the signal switching circuitry. The power switching circuitry allows power to be selectively delivered to the processor card, and the signal switching circuitry enables the processor card to be hot swapped in and out of a PCI hot swap bus. The processor card works in conjunction with a similar processor card on the bus to perform the hot swap procedure.

Abstract: An improved heat dissipating assembly for a server box body includes a box body and a sealing cover. A grid plate is transversely erected at the center of the box body. An upper end of one side of the grid plate is provided with a plurality of air-absorbing portions having fans therein. The other side of the grid plate has a plurality of main boards and heat dissipating plates insertably disposed thereon. The invention is characterized in that a suitable clearance is formed between a rear side of the grid plate of the box body and the partition plate, and a heat concentration area is also formed therebetween. The hot air from the main boards and the heat dissipating plates is discharged to the concentration area for drawing by the fans in the air-absorbing portions to the outside.

Abstract: A high-density system includes a plurality of system units. Each system unit includes a backplane and a plurality of central processing unit (CPU) cards plugged into the backplane. Each backplane has a servicing input/output (I/O) bus for carrying servicing I/O data. Each central processing unit (CPU) card is plugged into the corresponding backplane and capable of accepting data from the servicing I/O bus or sending data to the servicing I/O bus. The high-density system further includes at least one cable for connecting the servicing I/O busses of the system units so as to transfer the servicing I/O data, and a servicing control system. The servicing control system includes a switching system for selectively connecting only one of the CPU cards in the high-density system to the servicing I/O bus, and an I/O interface module electrically connected to the servicing I/O bus. The I/O interface module has at least a port to which an external device may be plugged.

Abstract: A high-density system includes a backplane, a plurality of central processing unit (CPU) cards, and a servicing control system. The backplane has a servicing input/output (I/O) bus for carrying servicing I/O data. The central processing unit (CPU) cards are plugged into the backplane and connected to the servicing I/O bus. The servicing control system includes a switching system for selectively connecting only one of the CPU cards to the servicing I/O bus, and an I/O interface module electrically connected to the servicing I/O bus. The I/O interface module comprises at least a port to which an external device may be plugged. The servicing control system selectively enables only one of the CPU cards to send servicing I/O data to the port or to receive servicing I/O data from the port.