Abstract: A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate.

Abstract: A circuit layout of a circuit substrate having a plurality of device bonding areas is provided. The circuit layout includes first pads, second pads, bridging lines, first outer leads and second outer leads. Each device bounding area is configured with one first pad and one second pad. The bridging lines are respectively disposed between any two adjacent device bounding areas and extended from a side of the first pad inside one device bounding area to a side of the second pad inside another one device bounding area adjacent to the first pad. Each first outer lead and each second outer lead are respectively corresponding to one first pad and one second pad, are respectively correspondingly extended into the device bounding area which the first pad and the second pad are located at, and are beside the first pad and the second pad correspondingly.

Abstract: A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate.

Abstract: A circuit layout of a circuit substrate having a plurality of device bonding areas is provided. The circuit layout includes first pads, second pads, bridging lines, first outer leads and second outer leads. Each device bounding area is configured with one first pad and one second pad. The bridging lines are respectively disposed between any two adjacent device bounding areas and extended from a side of the first pad inside one device bounding area to a side of the second pad inside another one device bounding area adjacent to the first pad. Each first outer lead and each second outer lead are respectively corresponding to one first pad and one second pad, are respectively correspondingly extended into the device bounding area which the first pad and the second pad are located at, and are beside the first pad and the second pad correspondingly.