Abstract: An interconnect structure on a semiconductor die includes: a lower conductive layer; an upper conductive layer disposed above the lower conductive layer; and a VIA disposed between the lower conductive layer and the upper conductive layer. The VIA includes: a primary interconnect structure and a sacrificial stress barrier ring disposed around the primary interconnect structure and separated a distance from the primary interconnect structure. A fabrication method for the interconnect structure includes: forming a dielectric layer over a lower conductive layer; patterning photoresist (PR) layer over the dielectric layer to define a location for a plurality of VIA trenches, wherein the patterning includes patterning the PR layer to provide a center opening for the VIA trenches that is surrounded by a ring opening for the VIA trenches, wherein the center opening and the ring opening are spaced apart.

Abstract: A communication device is provided. The communication device includes a heat dissipation case, a heat conductive member, a heat dissipation base, and a communication module. The heat conductive member is thermally connected to the heat dissipation case, and the heat dissipation base is pivotally connected to the heat conductive member. The heat dissipation base is thermally connected to the heat conductive member and is adapted to be rotated between a first orientation and a second orientation relative to the heat conductive member. The communication module is affixed to the heat dissipation base.

Abstract: A thermal module and method for controlling heat-dissipation wind amount thereof is provided. The thermal module is figured in an electronic apparatus having a first heat source and a second heat source. The thermal module includes at least a first wind outlet, a second wind outlet and a first wind-amount adjuster. The first wind outlet is for providing a first wind amount to the first heat source while the second wind outlet is for providing a second wind amount to the second heat source. The first wind-amount adjuster, disposed at the first wind outlet, is for adjusting the first wind amount according to temperature of the first heat source and the second heat source.

Abstract: An electronic device. The electronic device includes a circuit board, a heat dissipation module, and a light-emitting diode. The circuit board includes a heating element thereon. The heat dissipation module is disposed on the circuit board and the heating element. The light-emitting diode is disposed on the heat dissipation module. The heat dissipation module is connected to the heating element and the light-emitting diode.

Abstract: An electronic device is provided. The electronic device includes a housing and a thermal module. The housing includes an upper shell and a bottom shell. The thermal module is disposed inside the housing. The thermal module includes a first casing and a first block component. The first casing has a first wind opening. The first block component is disposed between the first casing and one of the upper shell or the bottom shell, and is disposed close to the first wind opening for preventing particles from entering the electronic device through the interval between the first casing and the housing.

Abstract: A thermal module and method for controlling heat-dissipation wind amount thereof is provided. The thermal module is figured in an electronic apparatus having a first heat source and a second heat source. The thermal module includes at least a first wind outlet, a second wind outlet and a first wind-amount adjuster. The first wind outlet is for providing a first wind amount to the first heat source while the second wind outlet is for providing a second wind amount to the second heat source. The first wind-amount adjuster, disposed at the first wind outlet, is for adjusting the first wind amount according to temperature of the first heat source and the second heat source.

Abstract: An electronic device. The electronic device includes a circuit board, a heat dissipation module, and a light-emitting diode. The circuit board includes a heating element thereon. The heat dissipation module is disposed on the circuit board and the heating element. The light-emitting diode is disposed on the heat dissipation module. The heat dissipation module is connected to the heating element and the light-emitting diode.

Abstract: A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a first section with a first surface, a second section with a second surface parallel to the first surface, and a connecting portion. The connecting portion connects the first and second sections and extends along a normal direction thereof. An air passage is formed between the first section and the second section, so that air passes sequentially through the first surface, the air passage and the second surface.

Abstract: A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a first section with a first surface, a second section with a second surface parallel to the first surface, and a connecting portion. The connecting portion connects the first and second sections and extends along a normal direction thereof. An air passage is formed between the first section and the second section, so that air passes sequentially through the first surface, the air passage and the second surface.