Patents by Inventor HSIANG-CHEN HO

HSIANG-CHEN HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11402733
    Abstract: A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: August 2, 2022
    Assignee: MEGA1 COMPANY LTD.
    Inventors: Makoto Masuda, Wen-Chieh Wu, Hsiang-Chen Ho, Chih-Han Yen, Chih-Yu Yang
  • Publication number: 20210373420
    Abstract: A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Inventors: MAKOTO MASUDA, WEN-CHIEH WU, HSIANG-CHEN HO, CHIH-HAN YEN, CHIH-YU YANG