Abstract: A system for information security management over 5G open architecture infrastructures, in which a controlled 5G open architecture system connected to the 5G open architecture central management system and performs data transmission. A 5G virtualized infrastructure information security monitoring system, arranged in the 5G open architecture central management system, selects the 5G open architecture central management system, the controlled 5G open architecture system, an intelligent controller management platform, or the 5G virtualized infrastructure information security monitoring system as a scanning target for monitoring. The 5G virtualized infrastructure information security monitoring system includes multiple types of information security risk models and scans the scanning target based on the usage restrictions of one of the multiple types of information security risk models, thereby generating an information security risk result.

Abstract: Methods for chemical mechanical polishing (CMP), and methods for forming an interconnect structure of a semiconductor device are provided. The methods include performing CMP on a surface of a dielectric structure with a CMP slurry to remove a portion of a metal layer formed in the dielectric structure and having at least a first layer exposed through the surface. In some examples, the CMP slurry that includes an abrasive, an oxidizing agent, and a compound configured to reduce aggregation of the abrasive on the surface of the dielectric structure. In some examples, the compound has positively charged ions that interact with the abrasive to reduce aggregation of the abrasive on a dielectric material. In some examples, the CMP slurry includes potassium hydroxide. In some examples, the compound includes an ammonium salt.

Abstract: A wavelength converter for LiDAR systems, such as automotive LiDAR, is disclosed. Implementation of the wavelength converter in LiDAR systems makes possible generation and modulation of laser light in the silicon response region, conversion of the laser light to an eye-safe wavelength for emission and reflection from a target, and efficient conversion of the wavelength of the laser light to the silicon response region. The wavelength converter may implement a single-loop counter-propagating wavelength conversion scheme which provides both up-conversion and down-conversion of the signal within the same loop. The wavelength conversion design also has the potential for vehicle-to-vehicle (V2V) communication to enable a combined LiDAR and V2V communication system.

Abstract: A high atomic number material is applied to one or more surfaces of a semiconductor structure of a wafer. The one or more surfaces are at a depth different from a depth of a surface of the wafer. An electron beam is scanned over the semiconductor structure to cause a backscattered electron signal to be collected at a collector. A profile scan of the semiconductor structure is generated based on an intensity of the backscattered electron signal, at the collector, resulting from the high atomic number material. The high atomic number material increases the intensity of the backscattered electron signal for the one or more surfaces of the semiconductor structure such that contrast in the profile scan is increased. The increased contrast of the profile scan enables accurate critical dimension measurements of the semiconductor structure.

Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

Abstract: A carton with a detachable buffer plate set includes a bottom plate, two long side plates, an upper cover, two short side plates, two reinforcing side plates, and a detachable buffer plate set. The long side plates and the short side plates are connected to the bottom plate. The upper cover is connected to one of the long side plates. The two reinforcing side plates are connected to the two short side plates respectively. The detachable buffer plate set is detachably connected to one of the reinforcing side plates. Accordingly, by detaching the detachable buffer plate set for supporting and buffering, products of similar size or products with accessories of different sizes may use the same-sized cartons and paper-plastic boxes, so that extra die-cutting costs and storage costs are avoided.

Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.

Abstract: The present disclosure relates to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The chemical vapor deposition chamber includes a spindle mechanism that cooperates with one or more carrier ring forks to move the semiconductor substrate from one station to another station. The methods include monitoring one or more spindle operation parameters and carrying out one or more maintenance steps on the spindle mechanism based on the results of monitoring the one or more spindle operation parameters. The monitored spindle operation parameters provide an indication of undesirable vibration of the semiconductor substrates in the processing chamber. The vibration of the semiconductor substrates in the processing chamber is undesirable because it promotes generation of unwanted particles that deposit onto a surface of the semiconductor substrate.

Abstract: A sampling front-end for analog to digital converter is presented that shares a high speed N-bit ADC at front-end and interleaves the pipelined residue amplification with shared amplifier, which achieves high speed, low power and compact area with high density capacitive DAC structure.

Abstract: A thin-film deposition system includes a top plate positioned above a wafer and configured to generate a plasma during a thin-film deposition process. The system includes a sensor configured to generate sensor signals indicative of a lifetime of a component of the thin-film deposition system, a characteristic of a thin-film deposited by the thin-film deposition system or a characteristic of a process material that flows into the thin-film deposition system. The system includes a control system configured to adjust a relative location of a top plate of the thin-film deposition system with respect to a location of a wafer in the thin-film deposition system during the thin-film deposition process responsive to the sensor signals.

Abstract: A hierarchical artificial intelligence (AI) computing system includes at least one group of a first layer AI subsystems and n second layer AI subsystems. One of the at least one group of a first layer AI subsystems includes m first layer AI subsystems, and each of the m first layer AI subsystems is configured to perform inference based on internal sensing data or a first external sensing data to generate a first inference result; and the n second layer AI subsystems are respectively connected to the at least one group of the first layer AI subsystems, where each of the n second layer AI subsystems is configured to perform inference based on m first inference results, an operation command, and a second external sensing data to generate a second inference result.

Abstract: A scan-type display apparatus includes an LED array and a data driver. The LED array has a common anode configuration, and includes multiple scan lines, multiple data lines and multiple LEDs. The data driver includes multiple data driving circuits, each of which includes a current driver and a detector. The current driver has an output terminal connected to the data line corresponding to the data driving circuit, and outputs one of a drive current and a clamp voltage at the output terminal of the current driver based on a pulse width control signal. The detector is connected to the current driver, and generates a detection signal that indicates whether any one of the LEDs connected to the data line corresponding to the data driving circuit is short circuited based on a detection timing signal and a feed-in voltage related to a voltage at the output terminal of the current driver.

Abstract: A semiconductor structure includes a first dielectric layer over a first conductive line and a second conductive line, a high resistance layer over a portion of the first dielectric layer, a low-k dielectric layer over the second dielectric layer, a second dielectric layer on the high resistance layer, a first conductive via extending through the low-k dielectric layer and the second dielectric layer, and a second conductive via extending through the low-k dielectric layer and the first dielectric layer to the first conductive line. The first conductive via extends into the high resistance layer.

Abstract: Disclosed is a reusable actuator for use with a drug container including a stopper comprising a container having a closed end, an open end, and a sidewall extending therebetween in a longitudinal direction, an electrode disposed inside the container for use in generating a gas, an actuating element disposed at and closing the open end of the container, the actuating element and the container defining an actuator interior, wherein the actuating element is movable relative to the container in the longitudinal direction by a gas pressure of the gas in the actuator interior, such that the actuating element applies a force to the stopper to cause a drug delivery from the drug container, and a retracting mechanism for use in removing the gas to assist the actuating element's retraction for reuse.

Abstract: A high atomic number material is applied to one or more surfaces of a semiconductor structure of a wafer. The one or more surfaces are at a depth different from a depth of a surface of the wafer. An electron beam is scanned over the semiconductor structure to cause a backscattered electron signal to be collected at a collector. A profile scan of the semiconductor structure is generated based on an intensity of the backscattered electron signal, at the collector, resulting from the high atomic number material. The high atomic number material increases the intensity of the backscattered electron signal for the one or more surfaces of the semiconductor structure such that contrast in the profile scan is increased. The increased contrast of the profile scan enables accurate critical dimension measurements of the semiconductor structure.

Abstract: An addition system of a reducing agent in a semiconductor manufacturing process includes pre-treatment and post-treatment gas concentration detection devices, a process exhaust gas treatment device, a reducing agent supply device, and an addition system control device. The process exhaust gas treatment device purifies exhaust gas of a semiconductor manufacturing process and emits a post-treatment gas. The reducing agent supply device supplies a reducing agent gas into the process exhaust gas treatment device. The post-treatment gas concentration detection device detects a residual concentration of the reducing agent gas in the post-treatment gas. The addition system control device calculates destruction and removal efficiency (DRE) for process gases according to pre-treatment and post-treatment gas concentrations, and, according to the DRE and the residual concentration, sends a signal to the reducing agent supply device to control the amount of the reducing agent gas added.

Abstract: The present disclosure relates to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The chemical vapor deposition chamber includes a spindle mechanism that cooperates with one or more carrier ring forks to move the semiconductor substrate from one station to another station. The methods include monitoring one or more spindle operation parameters and carrying out one or more maintenance steps on the spindle mechanism based on the results of monitoring the one or more spindle operation parameters. The monitored spindle operation parameters provide an indication of undesirable vibration of the semiconductor substrates in the processing chamber. The vibration of the semiconductor substrates in the processing chamber is undesirable because it promotes generation of unwanted particles that deposit onto a surface of the semiconductor substrate.

Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.

Abstract: A carton with a detachable buffer plate set includes a bottom plate, two long side plates, an upper cover, two short side plates, two reinforcing side plates, and a detachable buffer plate set. The long side plates and the short side plates are connected to the bottom plate. The upper cover is connected to one of the long side plates. The two reinforcing side plates are connected to the two short side plates respectively. The detachable buffer plate set is detachably connected to one of the reinforcing side plates. Accordingly, by detaching the detachable buffer plate set for supporting and buffering, products of similar size or products with accessories of different sizes may use the same-sized cartons and paper-plastic boxes, so that extra die-cutting costs and storage costs are avoided.