Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A rotary apparatus includes a casing having a top sunk opening and an axial hole that are coaxially with each other along an axial line. A top adjusting disc unit is fixed in the top sunk opening, and has a top inner surrounding surface and a top outer surrounding surface. A top inner hole of the top inner surrounding surface extends along a central line parallel to and offset from the axial line. The top outer surrounding surface is non-coaxial with the top inner surrounding wall. A passive gear unit is disposed in the axial hole, and is driven by an active gear unit that is driven by a drive unit in the casing. The passive gear unit has an output shaft extending along the central line. A top bearing is clamped between the top support portion and the top inner surrounding surface of the top adjusting disc unit.

Abstract: A patch is provided. The patch comprises: a base layer; and an adhesive layer formed on a surface of the base layer, the adhesive layer has a wave pattern such that 95% or less of the area of the surface of the base layer is covered by the adhesive of the adhesive layer, wherein, the patch has an elongation of at least 120% in both machine direction and cross-machine direction.

Abstract: An ear physiological wearable device, including a main body and a supporting body, is provided. The main body includes an acoustic driving portion, a temperature sensing portion and an optical scanning portion. The acoustic driving portion is adjacent to the temperature sensing portion, and the optical scanning portion is disposed below the acoustic driving portion and the temperature sensing portion. The supporting body is connected to the main body. The acoustic driving portion includes an acoustic outlet, and the temperature sensing portion includes a nozzle. Two ear physiological wearable devices, one of them including an acoustic driving portion with an acoustic end against the user's skull, another including a main body including a temperature sensing portion and an optical scanning portion, are provided. In this way, the audio signal can be transmitted and/or the users' physiological status can be sensed.