Patents by Inventor Hsiang-Cheng Tsai

Hsiang-Cheng Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL DEVICE PACKAGE
    Publication number: 20240243207
    Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Cheng TSAI, Ying-Chung CHEN, Kuo-Hua LAI
  • Optical device including an optical component an electrical component, assembly structure including an optical component an electrical component and method for manufacturing the same
    Patent number: 12040321
    Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: July 16, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsiang-Cheng Tsai, Ying-Chung Chen
  • OPTICAL DEVICE INCLUDING AN OPTICAL COMPONENT AN ELECTRICAL COMPONENT, ASSEMBLY STRUCTURE INCLUDING AN OPTICAL COMPONENT AN ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240096864
    Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Cheng TSAI, Ying-Chung CHEN
  • OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230136046
    Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier and a photonic component. The carrier includes an upper surface and a first lateral surface. The photonic component is disposed over an upper surface of the carrier and includes an optical portion. The carrier includes a recessed portion recessed from the first lateral surface of the carrier, and the optical portion of the photonic component is located within the recessed portion of the carrier from a top view perspective.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 4, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Cheng TSAI, Jui-Che WU
  • Optical device and method of manufacturing the same
    Patent number: 11276797
    Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 15, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsiang-Cheng Tsai, Lu-Ming Lai, Hsun-Wei Chan, Ying-Chung Chen