Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first wafer is provided. The first wafer includes a first substrate and a first device layer. A second wafer is provided. The second wafer includes a second substrate and a second device layer. The second device layer is bonded to the first device layer. An edge trimming process is performed on the first wafer and the second wafer to expose a first upper surface of the first substrate and a second upper surface of the first substrate and to form a damaged region in the first substrate below the first upper surface and the second upper surface. The second upper surface is higher than the first upper surface. A first photoresist layer is formed. The first photoresist layer is located on the second wafer and the second upper surface and exposes the first upper surface and the damaged region. The damaged region is removed by using the first photoresist layer as a mask. The first photoresist layer is removed.

Abstract: A connecting device including a housing, a connector and an elastic element is provided. The housing comprises a connector base including a bottom plate and a side wall, the bottom plate and the side wall jointly surround a space. The connector is disposed at the connector base and located in the space. The connector includes a positioning element and a plug terminal element connected to the positioning element. The positioning element including a limit portion is connected with the plug terminal element. The elastic element abuts between the plug terminal element and the bottom plate. When the plug terminal element is moved to a skewed position by an external force, the limit portion is moved away from the bottom plate. When the external force is disappeared, the limit portion returns to abut against the bottom plate, such that the plug element is in an upright position.

Abstract: A connector module is adapted to be disposed in a casing including a casing opening. The connector module includes a connector shell, an elastic rib, a connection terminal, a first and a second conductive layer. The connector shell includes a front side and a first opening. The first opening is aligned with the casing opening. The elastic rib is disposed and protrudes from the front side. The elastic rib surrounds the first opening. The connection terminal is disposed in the connector shell and exposed to the first opening. The first conductive layer is coated on the front side and the elastic rib, and contacts with the casing. The second conductive layer is laid on a side of the first conductive layer opposite to the front side and includes a second opening. The first opening and the elastic rib coated with the first conductive layer are exposed to the second opening.

Abstract: An electronic device including a casing, at least one connector and a waterproof elastic module is provided. The casing includes at least one first hole. The at least one connector is disposed in the casing, the at least one connector penetrates the at least one first hole and is exposed out of the at least one first hole, and at least one gap exists between walls of the casing encircling the at least one first hole and the corresponding at least one connector. The waterproof elastic module has at least one second hole, the waterproof elastic module sleeves the at least one connector, the at least one connector is exposed out of the at least one second hole, the waterproof elastic module covers and wraps around the at least one connector, and the at least one gap is filled with the waterproof elastic module.

Abstract: An electronic device housing includes a body and a protection cover. The body is provided with an opening; the protection cover and the body are integrally molded by injecting two or more materials; the protection cover is capable of shielding the opening; and the body has a first hardness, the protection cover has a second hardness, and the first hardness is different from the second hardness.

Abstract: An electronic device including a casing, at least one connector and a waterproof elastic module is provided. The casing includes at least one first hole. The at least one connector is disposed in the casing, the at least one connector penetrates the at least one first hole and is exposed out of the at least one first hole, and at least one gap exists between walls of the casing encircling the at least one first hole and the corresponding at least one connector. The waterproof elastic module has at least one second hole, the waterproof elastic module sleeves the at least one connector, the at least one connector is exposed out of the at least one second hole, the waterproof elastic module covers and wraps around the at least one connector, and the at least one gap is filled with the waterproof elastic module.

Abstract: A mold adapted to manufacture a first molding element and a second molding element in different shapes or sizes is provided. The mold includes a first mold core, a second mold core and a filling component. The second mold core is capable of being arranged at the first mold core or separated from the first mold core. When the second mold core is arranged at the first mold core, a first mold cavity is formed between the first and second mold cores, and the shape of the first mold cavity corresponds to that of the first molding element. The filling component is detachably arranged in a local region of the first mold cavity. When the second mold core is arranged at the first mold core and the filling component is arranged in the first mold cavity, a second cavity is formed between the first mold core, the second mold core and the filling component, and the shape of the second mold cavity corresponds to that of the second molding element. In addition, a method of using a mold is also provided.