Abstract: A heating assembly includes a heating sheet including a first insulating layer and a heating wire disposed on the heat sheet, and a wiring sheet including an insulating base layer disposed on the first insulating layer and a wiring cable disposed on the insulating base layer, the wiring cable is electrically connected to the heating wire, wherein the wiring cable has an impedance value that is lower than an impedance value of the heating wire.

Abstract: A cooling system block assembly may include a cooling system block and a circuit board assembly. The cooling system block includes a plurality of attachment members and one or more positioning members. The circuit board assembly is fixed to the cooling system block via the plurality of attachment members. The circuit board assembly includes a socket and a plate. The socket includes one or more positioning hubs and the plate includes a plurality of attachment hubs. The one or more positioning members is disposed within the one or more positioning hubs and the plurality of attachment members is fixed within the plurality of attachment hubs. When the one or more positioning members is disposed within the one or more positioning hubs and the plurality of attachment members is not fixed within the plurality of attachment hubs, the plurality of attachment members is vertically aligned with the plurality of attachment hubs.

Abstract: A captive screw includes a sleeve and a screwing member. The sleeve includes a body portion and a positioning protrusion. The positioning protrusion protrudes from the body portion, and forms a channel. The screwing member includes a head portion, a neck portion and a threaded portion. The neck portion connects the head portion and the threaded portion. The neck portion passes through the channel. The head portion and the threaded portion are located on the positioning protrusion. The threaded portion includes a wider section and a narrower section. The wider section is connected to the neck portion. The narrower section is connected to the wider section. The diameter of the channel is less than a major diameter of the wider section. The diameter of the channel is greater than or equal to a major diameter of the narrower section and a minor diameter of the wider section.

Abstract: A heat exchanger mounting device including a device plate, at least one securing device, and at least one cage is provided. The at least one securing device includes a barrel and pin. A first barrel end of the barrel is incorporated in at least one opening of the device plate. An augmented head of the pin extends at least partially through and rotatable in the barrel. The at least one cage is mounted on a heat exchanger. The augmented head extends through a cage opening of the at least one cage in a first direction. The augmented head rotates within the at least one cage in a second direction to secure the at least one securing device to the heat exchanger. The weight of the heat exchanger is substantially supported by the at least one securing device by way of the at least one cage and augmented head.

Abstract: A two-phase immersion cooling apparatus including a coolant tank, at least one condenser, a heat transfer enhancer, and at least one heat dissipating component is provided. Vapor and liquid regions are formed in the coolant tank. Pressure enhanced and boiling regions are formed in the heat transfer enhancer. Accelerated flow and at least one recycling flow region are formed between the heat transfer enhancer and coolant tank. The at least one condenser is in thermal communication with the vapor region. The pressure enhanced and boiling regions and accelerated flow and at least one recycling flow region, are in fluid communication thereamong. A temperature and pressure within the pressure enhanced and boiling regions is greater than that within the at least one recycling flow region, maximizing heat absorption and enhancing vapor bubble nucleation, and accelerating fluid circulation from the at least one recycling flow region to the boiling region.

Abstract: An anti-tilt pressure mount assembly adapted for mounting an IC cooling system block having a bottom surface to an upper surface of a packaged IC, the packaged IC mounted to a circuit board, comprising a block housing having a central member and pair of outwardly facing L-shaped flange legs, clamping assembly having ready and clamped positions, and plurality of attachment members is provided. The plurality of attachment members secure the anti-tilt pressure mount assembly to the circuit board. When the clamping assembly is in a ready position, the IC cooling system block housed in the block housing is not clamped to the packaged IC. When the clamping assembly is in a clamped position, a compressive load is uniformly distributed to the upper surface of the packaged IC. The bottom surface of the IC cooling system block is only in thermal contact with the upper surface of the packaged IC.

Abstract: A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipating device can efficiently dissipate the heat from the Central Processing Unit and another electronic element that is disposed in the vicinity of the Central Processing Unit. Furthermore, the air-guiding device can guide the air from the fan to the correct place for cooling the Central Processing Unit or another electronic element.

Abstract: A heat-dissipating structure is assembled on a CUP, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence the heat-dissipating device can dissipate efficiently the heat from the CPU and another electronic element that disposes around the CPU. Furthermore, the wind-guiding device can guide the wind from the fan to correct place for cooling the CPU or another electronic element. Hence the present invention can provide a comprehensive heat-dissipating effect on the CPU.

Abstract: A heat-dissipating device is provided. The heat-dissipating device is capable of cooperating a cross-flow type fan, mainly comprising a heat-conductive base plate attached with at least one heat-conductive pipe, and fixedly provided with a plurality of fins on the heat-conductive pipe. An air-outlet gap is naturally formed between any two of the adjacent fins, and an accommodating opening is disposed at an identical location on each of said fins. Within the accommodating opening, a cross-flow type fan is further presented. When fan blades of the cross-flow type fan rotating, an airflow thus generated is allowed for uniformly contacting with each of said fins and discharged through said air-outlet gaps. Thereby, not only the significantly raised effect of heat-dissipation of the heat-conductive base plate, but also the effectively reduced working noise due to a parallel path of the airflow with respect to the fins may be obtained.

Abstract: A heat-dissipating device is provided. The heat-dissipating device is capable of cooperating a cross-flow type fan, mainly comprising a heat-conductive base plate attached with at least one heat-conductive pipe, and fixedly provided with a plurality of fins on the heat-conductive pipe. An air-outlet gap is naturally formed between any two of the adjacent fins, and an accommodating opening is disposed at an identical location on each of said fins. Within the accommodating opening, a cross-flow type fan is further presented. When fan blades of the cross-flow type fan rotating, an airflow thus generated is allowed for uniformly contacting with each of said fins and discharged through said air-outlet gaps. Thereby, not only the significantly raised effect of heat-dissipation of the heat-conductive base plate, but also the effectively reduced working noise due to a parallel path of the airflow with respect to the fins may be obtained.

Abstract: The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.