Abstract: A heat dissipation module includes a main vapor chamber, at least one auxiliary vapor chamber, a main heat dissipation fin set and at least one auxiliary heat dissipation fin set. The auxiliary vapor chamber is in fluid communication with the main vapor chamber, the main heat dissipation fin set is installed on the main vapor chamber, the auxiliary heat dissipation fin set is connected to the auxiliary vapor chamber, and the auxiliary vapor chamber is arranged between the main heat dissipation fin set and the auxiliary heat dissipation fin set.

Abstract: A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.

Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

Abstract: A flexible vapor chamber includes a first flexible casing, a second flexible casing, a plurality of capillary strips and a plurality of inner capillary layers. The capillary strips are installed between the first flexible casing and the second flexible casing, and the inner capillary layers are arranged between the first flexible casing and the second flexible casing, and the capillary strips.

Abstract: A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.

Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes an inner cavity, a first capillary structure disposed within the inner cavity, and a first joint connected with the inner cavity. The heat pipe includes a pipe body, a second capillary structure, and a second joint disposed at the pipe body and connected to the first joint, such that a pipe space of the pipe body is in communication with the inner cavity. The second capillary structure includes a first section and a second section. The first section is fixedly disposed within a pipe space and connected to the second section. The second section is curvedly extended from one end of the first section, and connected to the first capillary structure. The working fluid is filled within the pipe space and the inner cavity.

Abstract: A vapor chamber is provided, which includes: a substrate; a diversion layer disposed on the substrate and having first openings and second openings; and at least one liquid passage formed between the substrate and the diversion layer, where the vapor chamber is defined with an evaporation area corresponding to a heat source and at least one condensation area, and the size of the first openings corresponding to the evaporation area and the condensation area is different from the size of the second openings corresponding to a non-evaporation area and a non-condensation area.

Abstract: A vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.

Abstract: A flexible vapor chamber for an electronic device includes an upper cover, a lower cover, an accommodation space, a capillary structure, plural support structures and a working fluid. The upper cover is made of a first flexible material. The lower cover is made of a second flexible material. The accommodation space is arranged between the upper cover and the lower cover. The capillary structure is disposed on the lower cover and accommodated within the accommodation space. The plural support structures are disposed on the upper cover and accommodated within the accommodation space. The plural support structures are contacted with the capillary structure. The working fluid is accommodated within the accommodation space. The flexible vapor chamber is permitted to be subjected to a flexural action in a flexible range. Consequently, the installation of the flexible vapor chamber complies with a shape of the electronic device.