Patents by Inventor HSIANG-CHIH HUNG

HSIANG-CHIH HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289880
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: March 29, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wen Lee, Hsiang-Chih Hung, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11205731
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: December 21, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wen Lee, Hsiang-Chih Hung, I-Ju Chen, Shu-Hua Yang, Yu-Hung Su
  • Publication number: 20200355357
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.
    Type: Application
    Filed: May 7, 2020
    Publication date: November 12, 2020
    Inventors: WEN LEE, HSIANG-CHIH HUNG, DA-PENG LYU, SHU-HUA YANG, YU-HUNG SU
  • Publication number: 20200357934
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.
    Type: Application
    Filed: May 5, 2020
    Publication date: November 12, 2020
    Inventors: Wen LEE, Hsiang-Chih HUNG, I-Ju CHEN, Shu-Hua YANG, Yu-Hung SU
  • Publication number: 20200358250
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.
    Type: Application
    Filed: May 7, 2020
    Publication date: November 12, 2020
    Inventors: Wen Lee, HSIANG-CHIH HUNG, SHU-HUA YANG, YU-HUNG SU
  • Patent number: 10816176
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: October 27, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wen Lee, Hsiang-Chih Hung, Da-Peng Lyu, Shu-Hua Yang, Yu-Hung Su
  • Publication number: 20180142497
    Abstract: A door lock includes a pivot base installed on a wall locate beside an openable door leaf; a holding unit connected to the pivot base; a guiding unit installed on the wall and located at one side of the holding unit for guiding the latter to move. When the door leaf is closed, the holding unit can be turned about the pivot base and along the guiding unit to a horizontal position for a free end to interfere with the door leaf, and a user can place personal articles on the holding unit. To open the door leaf, the user first takes back the personal articles before the holding unit can be turned and unlocked. Therefore, the door lock can lock a door leaf, hold a user's personal articles when locking the door leaf, and remind the user to take back the personal articles before opening the door leaf.
    Type: Application
    Filed: November 21, 2016
    Publication date: May 24, 2018
    Inventor: HSIANG-CHIH HUNG