Abstract: A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least one notch, and the solder pads are installed in an alignment direction on the printed circuit board, such that the notch positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract: A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least two cut edges, and the solder pads are installed in an alignment direction on the printed circuit board, such that the cut-edge positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract: A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least one notch, and the solder pads are installed in an alignment direction on the printed circuit board, such that the notch positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract: A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least two cut edges, and the solder pads are installed in an alignment direction on the printed circuit board, such that the cut-edge positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract: A peripheral connector includes a peripheral signal terminal set and a test signal terminal set for respectively electrically connecting a peripheral interface and a boundary scan interface of a microcomputer. A socket is selectively connectable to a peripheral device for data transmission between the peripheral device and the microcomputer or a test module for conducting a boundary scan test on the microcomputer. A converting unit has a logic circuit and a transmission circuit. The logic circuit converts an electric potential, which is transmitted from the socket and corresponds to one of the peripheral device and the test module that is connected to the socket, into a digital control signal for controlling enablement or disablement of the transmission circuit. The test module is able to conduct a boundary scan test on the microcomputer only when the transmission circuit is enabled.

Abstract: A peripheral connector includes a peripheral signal terminal set and a test signal terminal set for respectively electrically connecting a peripheral interface and a boundary scan interface of a microcomputer. A socket is selectively connectable to a peripheral device for data transmission between the peripheral device and the microcomputer or a test module for conducting a boundary scan test on the microcomputer. A converting unit has a logic circuit and a transmission circuit. The logic circuit converts an electric potential, which is transmitted from the socket and corresponds to one of the peripheral device and the test module that is connected to the socket, into a digital control signal for controlling enablement or disablement of the transmission circuit. The test module is able to conduct a boundary scan test on the microcomputer only when the transmission circuit is enabled.