Patents by Inventor Hsiang-Chin JUAN

Hsiang-Chin JUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copolymer, film composition and composite material employing the same
    Patent number: 11932714
    Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 19, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Yi Chu, Yun-Ching Lee, Li-Chun Liang, Wei-Ta Yang, Hsiang-Chin Juan
  • COPOLYMER, FILM COMPOSITION AND COMPOSITE MATERIAL EMPLOYING THE SAME
    Publication number: 20230063240
    Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.
    Type: Application
    Filed: July 22, 2022
    Publication date: March 2, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Yi CHU, Yun-Ching LEE, Li-Chun LIANG, Wei-Ta YANG, Hsiang-Chin JUAN