Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: A gas sensing system includes an air intake hole which comprises a plurality of micro-flow channels, a replaceable sensor for receiving an air from the air intake hole and detecting the received air, and a processing unit coupled to the replaceable sensor and doing determination for the component of the air according to a detection result of the replaceable sensor. Wherein, the replaceable sensor includes a plurality of sensing chips arranged in an array and each sensing chip is coated with a sensing thin film separately to detect a different gas.

Abstract: A gas sensing system includes an air intake hole which comprises a plurality of micro-flow channels, a replaceable sensor for receiving an air from the air intake hole and detecting the received air, and a processing unit coupled to the replaceable sensor and doing determination for the component of the air according to a detection result of the replaceable sensor. Wherein, the replaceable sensor includes a plurality of sensing chips arranged in an array and each sensing chip is coated with a sensing thin film separately to detect a different gas.

Abstract: A double-faced display apparatus includes a first transparent substrate, second transparent substrate, frame adhesive, first OELD, second OELD, first buffer layer, second buffer layer, first absorbent layer and second absorbent layer. The second transparent substrate is disposed in parallel to the first transparent substrate. The frame adhesive is disposed between the first transparent substrate and second transparent substrate for defining a space. The first OELD is disposed in the space and located on the first transparent substrate. The second OELD is disposed in the space and located on the second transparent substrate. The first buffer layer is disposed in the space and covers the first OELD. The second buffer layer is disposed in the space and covering the second OELD. The first absorbent layer is disposed in the space and covers the first buffer layer. The second absorbent layer is disposed in the space and covers the second buffer layer.

Abstract: The disclosed is a physisorption-based microcontact printing process capable of controlling film thickness, primarily for creating patterns of thin film of organic molecules in micron and submicron scales, comprising an inking phase, a printing phase, and a demolding phase. The inking phase is combined with a thin-film growth approach, wherein the thin-film approach enables growth of an organic thin film with desired thickness onto a stamp, effectively controls the thickness of the pattern of the organic thin film transferred in the next printing phase. The demolding phase enables proper control of the temperature of and the printing pressure upon the transferred thin-film pattern to control the quality of surface roughness and residual internal stress in the printed pattern.

Abstract: A double-faced display apparatus includes a first transparent substrate, second transparent substrate, frame adhesive, first OELD, second OELD, first buffer layer, second buffer layer, first absorbent layer and second absorbent layer. The second transparent substrate is disposed in parallel to the first transparent substrate. The frame adhesive is disposed between the first transparent substrate and second transparent substrate for defining a space. The first OELD is disposed in the space and located on the first transparent substrate. The second OELD is disposed in the space and located on the second transparent substrate. The first buffer layer is disposed in the space and covers the first OELD. The second buffer layer is disposed in the space and covering the second OELD. The first absorbent layer is disposed in the space and covers the first buffer layer. The second absorbent layer is disposed in the space and covers the second buffer layer.

Abstract: A direct and effective method of fabricating full-color OLED arrays on the basis of microcontact printing process is disclosed. The key of the method lies in a physisorption-based microcontact printing process capable of controlling thickness of the printed films. The organic EL materials involved can be of either small or large molecular weights, as long as they are suitable for solution process.

Abstract: A dual emission display and a method of manufacturing a dual emission display are provided. The method comprises providing a substrate having a first region and a second region, forming a light shielding layer on the second region, forming a controlling device on the light shielding layer, forming an organic emitting device electrically connected to the controlling device, thereby completing a first display device. The first display device and a second display device, obtained by repeating the above procedures, are oppositely disposed and packaged to complete the dual emission display.