Patents by Inventor Hsiang-Chu Hu

Hsiang-Chu Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System, control method and apparatus for chemical mechanical polishing
    Patent number: 10792783
    Abstract: A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: October 6, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Chu Hu, Chun-Hai Huang, Mu-Han Cheng, Yu-Chin Tseng, Chien-Chih Chen, Tzu-Shin Chen
  • SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING
    Publication number: 20190160625
    Abstract: A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.
    Type: Application
    Filed: January 12, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsiang-Chu Hu, Chun-Hai Huang, Mu-Han Cheng, Yu-Chin Tseng, Chien-Chih Chen, Tzu-Shin Chen