Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.

Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.

Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.

Abstract: An optical imaging lens device includes, in order from the object side to the image side: a first lens element having positive refractive power and an object-side surface convex in a paraxial region thereof; a second lens element having negative refractive power and an object-side surface concave in a paraxial region thereof; a third lens element having positive refractive power, an object-side surface concave in a paraxial region thereof, and an image-side surface convex in a paraxial region thereof; a fourth lens element having negative refractive power, an object-side surface convex in a paraxial region thereof and concave in an off-axis region thereof, and an image-side surface concave in a paraxial region thereof and convex in an off-axis region thereof. When a certain condition is satisfied, the optical imaging lens device may have both a compact size and wide field of view.

Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.

Abstract: An optical imaging lens device includes, in order from the object side to the image side: a first lens element having positive refractive power and an object-side surface convex in a paraxial region thereof; a second lens element having negative refractive power and an object-side surface concave in a paraxial region thereof; a third lens element having positive refractive power, an object-side surface concave in a paraxial region thereof, and an image-side surface convex in a paraxial region thereof; a fourth lens element having negative refractive power, an object-side surface convex in a paraxial region thereof and concave in an off-axis region thereof, and an image-side surface concave in a paraxial region thereof and convex in an off-axis region thereof. When a certain condition is satisfied, the optical imaging lens device may have both a compact size and wide field of view.

Abstract: A cell culture module, a cell culture system and a cell culture method are provided. The cell culture module includes a casing, a first fixer, a second fixer and a sheet-shaped carrier member. The casing has a chamber and at least one inlet/outlet. The inlet/outlet communicates with the chamber. The first fixer is fixed to the casing and located in the chamber. The second fixer is disposed in the chamber and is movable relative to the first fixer. The sheet-shaped carrier member is formed by arranging a plurality of cell culture carriers, and two opposite ends of the sheet-shaped carrier member are respectively fixed to the first fixer and the second fixer. The sheet-shaped carrier member is in an open state or a folded state according to a variation in a distance between the first fixer and the second fixer due to a movement of the second fixer.

Abstract: A cell culture module, a cell culture system and a cell culture method are provided. The cell culture module includes a casing, a first fixer, a second fixer and a sheet-shaped carrier member. The casing has a chamber and at least one inlet/outlet. The inlet/outlet communicates with the chamber. The first fixer is fixed to the casing and located in the chamber. The second fixer is disposed in the chamber and is movable relative to the first fixer. The sheet-shaped carrier member is formed by arranging a plurality of cell culture carriers, and two opposite ends of the sheet-shaped carrier member are respectively fixed to the first fixer and the second fixer. The sheet-shaped carrier member is in an open state or a folded state according to a variation in a distance between the first fixer and the second fixer due to a movement of the second fixer.

Abstract: The disclosure provides a cell culture system and a serum-free method for cultivating cells. The cell culture system includes a substratum, wherein the substratum has a surface. A polymer is disposed on the surface of the substratum, wherein the polymer is prepared by polymerizing a first monomer with a second monomer. The first monomer has a structure as represented by Formula (I), and the second monomer has a structure as represented by Formula (II): wherein, R1 is hydrogen or methyl; R2 is methyl, ethyl, or —CH2CH2OCH3; R3 is hydrogen or methyl; and, R4 is hydrogen, —CH2CH2OCOCHCHCOOH, —CH2CH2OCOCH2CH2COOH, or —CH2CH2COOH.

Abstract: The disclosure provides a cell culture system and a serum-free method for cultivating cells. The cell culture system includes a substratum, wherein the substratum has a surface. A polymer is disposed on the surface of the substratum, wherein the polymer is prepared by polymerizing a first monomer with a second monomer. The first monomer has a structure as represented by Formula (I), and the second monomer has a structure as represented by Formula (II): wherein, R1 is hydrogen or methyl; R2 is methyl, ethyl, or —CH2CH2OCH3; R3 is hydrogen or methyl; and, R4 is hydrogen, —CH2CH2OCOCHCHCOOH, —CH2CH2OCOCH2CH2COOH, or —CH2CH2COOH.