Patents by Inventor HSIANG-CHUN WEI

HSIANG-CHUN WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11507020
    Abstract: An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: November 22, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Chun Wei, Chung-Lun Kuo, Chia-Hung Cho, Chun-Wei Lo, Chih-Hsiang Liu
  • Publication number: 20210231570
    Abstract: An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 29, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yan-Rung Lin, Chih-Hsiang Liu, Chung-Lun Kuo, Hsiang-Chun Wei, Yeou-Sung Lin, Chieh-Yi Lo
  • Publication number: 20210149337
    Abstract: An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.
    Type: Application
    Filed: September 22, 2020
    Publication date: May 20, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Chun WEI, Chung-Lun KUO, Chia-Hung CHO, Chun-Wei LO, Chih-Hsiang LIU
  • Patent number: 9752866
    Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: September 5, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Chun Wei, Yi-Sha Ku, Chia-Hung Cho, Chieh-Yu Wu, Chun-Wei Lo, Chih-Hsiang Liu
  • Publication number: 20170146339
    Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 25, 2017
    Inventors: Hsiang-Chun WEI, Yi-Sha KU, Chia-Hung CHO, Chieh-Yu WU, Chun-Wei LO, Chih-Hsiang LIU
  • Patent number: 9030746
    Abstract: The present invention discloses a fabrication method of a microlens array (MLA) and an MLA fabricated using the same. The fabrication method of an MLA comprises: providing a substrate with an interface hydrophilic modified polymer layer; using light, gas or liquid with the property of converting the polymer' hydrophilicity to create a hydrophilic zone on the interface hydrophilic modified polymer layer; coating the substrate with a liquid material to condense a plurality of liquid microlenses in the hydrophilic zone; and curing the plurality of liquid microlenses to form a plurality of microlenses. Therefore, the fabrication method of an MLA has advantages of fast speed, low cost, no etch transfer and low temperature.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 12, 2015
    Assignee: National Taiwan University
    Inventors: Hsiang-Chun Wei, Guo-Dung Su
  • Publication number: 20130329300
    Abstract: The present invention discloses a fabrication method of a microlens array (MLA) and an MLA fabricated using the same. The fabrication method of an MLA comprises: providing a substrate with an interface hydrophilic modified polymer layer; using light, gas or liquid with the property of converting the polymer' hydrophilicity to create a hydrophilic zone on the interface hydrophilic modified polymer layer; coating the substrate with a liquid material to condense a plurality of liquid microlenses in the hydrophilic zone; and curing the plurality of liquid microlenses to form a plurality of microlenses. Therefore, the fabrication method of an MLA has advantages of fast speed, low cost, no etch transfer and low temperature.
    Type: Application
    Filed: November 20, 2012
    Publication date: December 12, 2013
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: HSIANG-CHUN WEI, GUO-DUNG SU