Patents by Inventor Hsiang Feng Chen

Hsiang Feng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131819
    Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.
    Type: Application
    Filed: May 3, 2023
    Publication date: April 25, 2024
    Inventors: KAI-WEI LO, WEN-FENG LEE, HSIANG-YUN YANG, KUO-HSUN CHEN
  • Patent number: 11950432
    Abstract: A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first semiconductor substrate, a first bonding structure and a memory cell. The second semiconductor device is stacked over the first semiconductor device. The second semiconductor device includes a second semiconductor substrate, a second bonding structure in a second dielectric layer and a peripheral circuit between the second semiconductor substrate and the second bonding structure. The first bonding structure and the second bonding structure are bonded and disposed between the memory cell and the peripheral circuit, and the memory cell and the peripheral circuit are electrically connected through the first bonding structure and the second bonding structure.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Ku Shen, Ku-Feng Lin, Liang-Wei Wang, Dian-Hau Chen
  • Publication number: 20240096297
    Abstract: In some examples, a controller of a wearable device causes display by the wearable device of a test image, and adjusts a color property of the displayed test image. In response to an input provided by a user responsive to the displayed test image as the color property is adjusted, the controller determines a distribution of color wavelengths for an eye of the user, and detects a color vision deficiency of the user based on the determined distribution of color wavelengths. The controller provides control information to control a display device of the wearable device to compensate for the color vision deficiency.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Hsiang-Ta Ke, Yu-Ren Chen, Chun-Feng Li
  • Publication number: 20240071872
    Abstract: A via-filling method of a TGV substrate includes steps: filling a plurality of metal balls into a plurality of vias of the TGV substrate; using a heating process to melt the plurality of metal balls to form a liquid-state metal; and cooling down the liquid-state metal to form a solid-state metal inside the plurality of vias. Because the method needn't use solvents or fluxes, the solid-state metal inside the plurality of vias have better electric conductivity.
    Type: Application
    Filed: February 7, 2023
    Publication date: February 29, 2024
    Applicant: Ingentec Corporation
    Inventors: Hsiao Lu Chen, AI SEN LIU, HSIANG AN FENG, YA LI CHEN
  • Publication number: 20240072033
    Abstract: A bonding and transferring method for die package structures is provided, including providing a die package structure which has a positioning adhesive disposed thereon, and providing a vibration base having at least one cavity corresponding to the positioning adhesive. By alignment of the positioning adhesive and the cavity, the die package structure can be positioned into the vibration base. A target substrate is further provided and bonded with the vibration base having the die package structure disposed thereon through a metal material. And a laser process is then performed to melt the metal material. At last, the vibration base and the positioning adhesive are removed so the die package structure is successfully bonded and transferred onto the target substrate. By employing the proposed process method of the present invention, rapid mass transfer result is accomplished, and the packaging yield of vertical light emitting diode die package structures is optimized.
    Type: Application
    Filed: February 7, 2023
    Publication date: February 29, 2024
    Applicant: Ingentec Corporation
    Inventors: Hsiao Lu Chen, AI SEN LIU, HSIANG AN FENG, YA LI CHEN
  • Publication number: 20240072013
    Abstract: A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a second metal material, and a transparent glue is used to cover thereon. A laser process is then employed to dissolve the transparent glue for forming ditches. And, a conductive liquid is applied to fill the ditches and an insulating glue is provided to embrace and encapsulate the vertical light emitting diode dies. By employing the packaging method of the present invention, the current external wire bonding process can be effectively replaced, thereby die size miniaturization as well as packaging yield of the vertical light emitting diode dies are believed to be optimized.
    Type: Application
    Filed: February 7, 2023
    Publication date: February 29, 2024
    Applicant: Ingentec Corporation
    Inventors: HSIAO LU CHEN, AI SEN LIU, HSIANG AN FENG
  • Publication number: 20240071799
    Abstract: A system for a semiconductor fabrication facility comprises a transporting tool configured to move a carrier, a first manufacturing tool configured to accept the carrier facing in a first direction, a second manufacturing tool configured to accept the carrier facing in the second direction, and an orientation tool. The carrier is moved to the orientation tool by the transporting tool prior to being moved to the first manufacturing tool or the second manufacturing tool by the transporting tool. The orientation tool rotates the carrier so that the carrier is accepted by the first manufacturing tool or the second manufacturing tool. The transporting tool, the first manufacturing tool, the second manufacturing tool and the orientation tool are physically separated from each other.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: CHUAN WEI LIN, FU-HSIEN LI, YONG-JYU LIN, RONG-SHEN CHEN, CHI-FENG TUNG, HSIANG YIN SHEN
  • Patent number: 10249981
    Abstract: This invention relates to a high-speed signal transmission connector with high water resistance, which includes at least a casing and a terminal block. A first seal ring is provided on said casing, a second seal ring is set between said casing and said terminal block and a third seal ring is mounted inside said terminal block. So that the second seal ring and the third seal ring of the present invention enable the connector to have an internal waterproof function, and the first seal ring also enable the connector to have a waterproof connection function. With this triple-waterproof technology, the present invention ensures that the external moisture will not infiltrate into the connector and enhances the water resistance and safety of the high-speed signal transmission connector.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: April 2, 2019
    Assignee: AIMMET INDUSTRIAL CO., LTD.
    Inventor: Hsiang Feng Chen
  • Publication number: 20190052012
    Abstract: This invention relates to a high-speed signal transmission connector with high water resistance, which includes at least a casing and a terminal block. A first seal ring is provided on said casing, a second seal ring is set between said casing and said terminal block and a third seal ring is mounted inside said terminal block. So that the second seal ring and the third seal ring of the present invention enable the connector to have an internal waterproof function, and the first seal ring also enable the connector to have a waterproof connection function. With this triple-waterproof technology, the present invention ensures that the external moisture will not infiltrate into the connector and enhances the water resistance and safety of the high-speed signal transmission connector.
    Type: Application
    Filed: January 18, 2018
    Publication date: February 14, 2019
    Inventor: HSIANG FENG CHEN
  • Patent number: 9455540
    Abstract: This invention relates to a high-speed signal transmission device, which includes a first transmission device and a second transmission device. Said first transmission device has a first signal cable with a first plug connector and second plug connector on it both ends, said second transmission device has a second signal cable with a third plug connector and fourth plug connector on it both ends. Using a first socket connector and a third socket connector to connect said first plug connector and third plug connector, and using a second socket connector and a fourth socket connector to connect said second plug connector and fourth plug connector to connect first transmission device and a second transmission device electrically to get the signal transmission speed of USB 3.0 and to enhance the rate of signal transmission.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: September 27, 2016
    Assignee: AIMMET INDUSTRIAL CO., LTD.
    Inventor: Hsiang Feng Chen
  • Publication number: 20160211631
    Abstract: This invention relates to a high-speed signal transmission device, which includes a first transmission device and a second transmission device. Said first transmission device has a first signal cable with a first plug connector and second plug connector on it both ends, said second transmission device has a second signal cable with a third plug connector and fourth plug connector on it both ends. Using a first socket connector and a third socket connector to connect said first plug connector and third plug connector, and using a second socket connector and a fourth socket connector to connect said second plug connector and fourth plug connector to connect first transmission device and a second transmission device electrically to get the signal transmission speed of USB 3.0 and to enhance the rate of signal transmission.
    Type: Application
    Filed: January 19, 2015
    Publication date: July 21, 2016
    Inventor: HSIANG FENG CHEN
  • Patent number: 7811126
    Abstract: A connector includes a body, a terminal base and a fixing base. The body has a terminal base groove consisting of a circular portion and a square portion suited to the profile of the terminal base. A protective base is provided to protect a first tenon from erroneously touched. A second tenon is utilized to engage with an annular recessed groove of the terminal base to combine the body with the terminal base in a first stage. The body has two sides having a first engaging projecting member and plural second engaging projecting members for engaging with those of the fixing base to complete a two-step engagement to enable the body, the terminal base and the fixing base combined together. The fixing base includes plural projecting-out rods and projecting-up rods to make the body combined with the fixing base, facilitating the connector conveniently assembled.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: October 12, 2010
    Assignee: Aimmet Industrial Co., Ltd.
    Inventor: Hsiang Feng Chen
  • Patent number: 7335065
    Abstract: A cable adaptor includes a female connector, a male connector and a terminal base. The female connector has a male terminal hole for a male terminal of the terminal base to fit so that another exterior connector may fit therein and easily pulled off. The male connector is combined with the male terminal of the terminal base, having plural elastic petals fitted integrally around the terminal hole so that another exterior connector may fit therein and elastically held. The terminal base has a male terminal at one end and a female terminal at the other end, a male terminal at two ends respectively, or a female terminal at two ends respectively. The cable adaptor has a FARKA SMB (F.S.) male connector and a F.S. female connector, two F.S. male connectors or two F.S. female connectors, or a F.S. male or female connector and a SMB male or female conductor.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: February 26, 2008
    Assignee: Aimmet Industrial Co., Ltd.
    Inventor: Hsiang-Feng Chen
  • Patent number: 7052319
    Abstract: A connector includes a body and a terminal. The body has an interior hollow for the terminal to fit therein and an outer surface provided with plural axial projecting ridges. The interior hollow has a large diameter portion, a medium diameter portion and a small diameter portion. The terminal is made of a metal, having an insulating tubular member, a large annular wall in an intermediate portion and a small annular wall behind the large annular wall, and the large annular wall fits in the medium diameter portion of the interior hollow of the body, and the small annular wall fits in the small diameter portion. So the terminal may be combined with the body stably.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: May 30, 2006
    Assignee: Aimmet Ibdustrial Co., Ltd.
    Inventor: Hsiang Feng Chen