Patents by Inventor Hsiang-Fu “Benior” Chen

Hsiang-Fu “Benior” Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for eliminating delamination between amorphous silicon layers
    Patent number: 7999257
    Abstract: A circuit structure includes a substrate; a first amorphous silicon layer over the substrate; a first glue layer over and adjoining the first amorphous silicon layer; and a second amorphous silicon layer over and adjoining the first glue layer.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: August 16, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiou-Kang Lee, Chun-Ren “Sean” Cheng, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu “Benior” Chen