Patents by Inventor Hsiang H. Liu

Hsiang H. Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11787109
    Abstract: The present invention relates to 3-D structures having high temperature stability and improved micro-porosity as well as processes of making and using same. The disclosed 3-D are advantageous because they have low densities and low permittivities. When compared to previous 3-D structures, the present structures maintain their low permittivities over a broader range of electromagnetic frequencies. Thus, when used in communication devices such as array antennas, can provided higher communication performance in high temperature environments.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: October 17, 2023
    Assignee: United States of America as represented by the Secretary of the Air Force
    Inventors: Hsiang H. Liu, James O. Hardin, IV, John D. Berrigan
  • Patent number: 11613077
    Abstract: The present invention relates to 3-D structures having high temperature stability and improved micro-porosity as well as processes of making and using same. The disclosed 3-D are advantageous because they have low densities and low permittivities. When compared to previous 3-D structures, the present structures maintain their low permittivities over a broader range of electromagnetic frequencies. Thus, when used in communication devices such as array antennas, can provided higher communication performance in high temperature environments.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: March 28, 2023
    Assignee: United States of America as represented by the Secretary of the Air Force
    Inventors: Hsiang H. Liu, James O. Hardin, IV, John D. Berrigan