Patents by Inventor Hsiang-Hua Huang

Hsiang-Hua Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240373545
    Abstract: An electronic package and a manufacturing method thereof are provided, in which support members are disposed on a carrier structure having a plurality of electrical contact pads, and a conductive element is bonded on each of the electrical contact pads, and an electronic module is disposed on the carrier structure via the conductive elements, so that the support members contact and support the electronic module to prevent the electronic module from warping.
    Type: Application
    Filed: April 18, 2024
    Publication date: November 7, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hsiang-Hua HUANG, I-Tang LIU, Mu-Hsuan CHAN
  • Patent number: 10763237
    Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: September 1, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yu-Min Lo, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang
  • Publication number: 20200091109
    Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Inventors: Yu-Min Lo, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang
  • Patent number: 10522500
    Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: December 31, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yu-Min Lo, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang
  • Publication number: 20190252344
    Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.
    Type: Application
    Filed: May 15, 2018
    Publication date: August 15, 2019
    Inventors: Yu-Min Lo, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang
  • Publication number: 20060070995
    Abstract: An upper cover of a garbage can includes a fitting frame, an upper cover body, an outer frame and two combining members. The combining members are respectively composed of a pivotal cylinder and a torsion spring, combined with the pivotal members of the upper cover body and the inner frame, letting the upper cover body to swing slowly up to an open upright condition or swing down to a closed condition with the pivotal members as pivots and by means of the torsion springs immersed in friction oil and turned in an untwisted natural condition or in a twisted condition. The upper cover body is pivotally combined with the inner side of the fitting frame combined with an outer frame, which is then assembled on the upper edge of a garbage can, letting the upper cover swung down or up to close or open slowly without noise by pressing.
    Type: Application
    Filed: October 4, 2004
    Publication date: April 6, 2006
    Inventor: Hsiang-Hua Huang
  • Publication number: 20050082285
    Abstract: A collapsible refuse can includes a can body, a bottom, a cap, a pedal and a cap opening member and plural bag hangers. The can body consists of two half shells combined by means of elongate hooks, with the bottom fitted firmly in a lower open side with an open upper side closed with a cap possible to be opened by the cap opening member, when the cap opening member is lifted up by the pedal stepped down. And a refuse bag is secured on an upper inner surface of the can body by means of the plural bag hangers. Then the collapsible refuse can has a small size when collapsed, beneficial for carrying, transporting and storing.
    Type: Application
    Filed: October 20, 2003
    Publication date: April 21, 2005
    Inventor: Hsiang-Hua Huang