Patents by Inventor Hsiang-Jui Wang

Hsiang-Jui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250083184
    Abstract: A method for forming a two-color coating layer includes steps of: a) conducting a coating process by applying a coating layer on a workpiece having a stepped surface, so that the coating layer having a first color is formed on the stepped surface, the stepped surface having a lower region, an upper region, and a middle shoulder region; b) forming an ink layer that has a second color and that covers the coating layer; c) soft baking the ink layer; d) exposing to light a first area of the ink layer so that the first area undergoes a crosslinking reaction; e) developing the ink layer so that a second area of the ink layer is removed; and f) hard baking the ink layer, wherein the stepped surface has the second color formed on the lower and middle shoulder regions, and the first color formed on the upper region.
    Type: Application
    Filed: March 21, 2024
    Publication date: March 13, 2025
    Inventors: Shun-Jie YANG, Hsiang-Jui WANG, Chi-Heng LIU, Cheng-Ping HSIAO
  • Publication number: 20250052267
    Abstract: A method for combining heterogeneous metal parts includes steps of: a) disposing a first metal part in a mold cavity of a lower mold, the first metal part including a bottom portion, a vertical portion, and an extension portion; b) disposing a first upper mold on the upper surface of the extension portion of the first metal part; c) before or after step a), providing a bonding adhesive on the bottom portion of the first metal part; and d) after steps a), b), and c), pressing a second metal part downwardly to force a lower surface of second metal part to press against the bonding adhesive.
    Type: Application
    Filed: January 10, 2024
    Publication date: February 13, 2025
    Inventors: Cheng-ping HSIAO, Hsiang-Jui WANG
  • Publication number: 20250050557
    Abstract: A method for combining heterogeneous metal parts includes steps of: a) disposing a first metal part and a second metal part in a lower mold cavity of a lower mold, the lower mold cavity having a lower portion and an upper portion, the lower mold including a channel that communicates with an external environment; b) combining an upper mold and the lower mold with an upper mold cavity of the upper mold facing the lower mold cavity, the upper mold cavity being defined by an inner base surface and an inner surrounding surface; and c) injecting a bonding adhesive into the channel so as to fill the lower portion of the lower mold cavity and a gap between the first metal part and the second metal part with the bonding adhesive.
    Type: Application
    Filed: January 24, 2024
    Publication date: February 13, 2025
    Inventors: Cheng-Ping HSIAO, Hsiang-Jui WANG
  • Patent number: 12180604
    Abstract: A method for coating a substrate includes the steps of: forming a conductive coating layer on a surface of a substrate so as to form a semi-product; submerging a conductive sheet and the semi-product into an electrophoresis medium that includes charged colloid particles; and applying a voltage on the conductive sheet or the semi-product to form an electric field among the conductive sheet, the semi-product, and the electrophoresis medium, so that the colloid particles move along the electric field toward the semi-product and an electrophoretic covering layer formed by the charged colloid particles is thus deposited on the electrophoretic covering layer.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: December 31, 2024
    Assignee: GIANT GLORY INTERNATIONAL LIMITED
    Inventors: Shun-Jie Yang, Hsiang-Jui Wang, Cheng-Ping Hsiao
  • Patent number: 12018389
    Abstract: The present invention provides a surface treatment method for magnesium alloy object, the method comprising: providing a magnesium alloy object; preprocessing the magnesium alloy object; performing micro-arc oxidation (MAO) treatment on the magnesium alloy object to form a micro-arc oxidation layer; Sputtering at least one metal layer or at least one non-metal layer on a surface of the micro-arc oxidation layer, the metal layer or non-metal layer which is sputtered on the micro-arc oxidation layer has different angles by using surface roughness of the micro-arc oxidation layer when a light source is projected on the metal layer or non-metal layer; and Sputtering a paint layer on the metal layer or non-metal layer to make the surface metallic lustrous and corrosion-resistant. The present invention further provides a surface structure of a magnesium alloy object.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: June 25, 2024
    Assignee: JU TENG INTERNATIONAL HOLDINGS LTD.
    Inventors: Hsiang-Jui Wang, Shun-Jie Yang, Cheng-Ping Hsiao
  • Publication number: 20230160088
    Abstract: A method for coating a substrate includes the steps of: forming a conductive coating layer on a surface of a substrate so as to form a semi-product; submerging a conductive sheet and the semi-product into an electrophoresis medium that includes charged colloid particles; and applying a voltage on the conductive sheet or the semi-product to form an electric field among the conductive sheet, the semi-product, and the electrophoresis medium, so that the colloid particles move along the electric field toward the semi-product and an electrophoretic covering layer formed by the charged colloid particles is thus deposited on the electrophoretic covering layer.
    Type: Application
    Filed: May 17, 2022
    Publication date: May 25, 2023
    Inventors: Shun-Jie YANG, Hsiang-Jui WANG, Cheng-Ping HSIAO
  • Publication number: 20220095469
    Abstract: A composite structure includes a passivated substrate, a sealing layer, a conductive layer, and a coating layer. The passivated substrate includes a substrate body made of a metallic material that is magnesium or magnesium alloy, and a porous passivation layer which is disposed on the substrate body, and which is made of an oxide of the metallic material. The sealing layer is disposed on the porous passivation layer, and is made of a sealing material. The conductive layer is disposed on the sealing layer, and is made of an electrically conductive material. The coating layer covers the conductive layer, and includes an electrophoretic material and/or a metal. A method of making the composite structure is also disclosed.
    Type: Application
    Filed: November 25, 2020
    Publication date: March 24, 2022
    Inventors: Hsiang-Jui WANG, Shun-Jie YANG, Cheng-Ping HSIAO
  • Publication number: 20220010435
    Abstract: The present invention provides a surface treatment method for magnesium alloy object, the method comprising: providing a magnesium alloy object; preprocessing the magnesium alloy object; performing micro-arc oxidation (MAO) treatment on the magnesium alloy object to form a micro-arc oxidation layer; Sputtering at least one metal layer or at least one non-metal layer on a surface of the micro-arc oxidation layer, the metal layer or non-metal layer which is sputtered on the micro-arc oxidation layer has different angles by using surface roughness of the micro-arc oxidation layer when a light source is projected on the metal layer or non-metal layer; and Sputtering a paint layer on the metal layer or non-metal layer to make the surface metallic lustrous and corrosion-resistant. The present invention further provides a surface structure of a magnesium alloy object.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 13, 2022
    Inventors: Hsiang-Jui WANG, Shun-Jie YANG, Cheng-Ping HSIAO
  • Publication number: 20210308750
    Abstract: The present invention provides a bi-metal assembling method. The method provides a machine-shaped aluminum piece and places the machine-shaped aluminum piece into a die-cast mold. The machine-shaped aluminum piece is encapsulated with a magnesium metal liquid and die cast is performed. The assembled bi-metal structure is coated for protection and CNC high-gross treatment and anodizing treatment is performed in the machine-shaped aluminum piece. The magnesium alloy piece is hooked with the machine-shaped aluminum piece for assembling. The bi-metal structure has smooth surface to reduce the time for polishing, surface shrinkage and generation of blowholes. The present invention also provides a bi-metal assembled structure.
    Type: Application
    Filed: April 1, 2020
    Publication date: October 7, 2021
    Inventors: Hsiang-Jui WANG, Shun-Jie YANG, Cheng-Ping HSIAO
  • Publication number: 20210285122
    Abstract: A high-gross manufacturing method for magnesium alloy object includes providing a magnesium alloy object; performing micro-arc oxidation or conversion coating treatment on the magnesium alloy object to form oxide film on a surface of the magnesium alloy object; spraying a paint layer on MAO-treated or conversion coating-treated surface of the magnesium alloy object to protect the magnesium alloy object; performing CNC high gross cutting to cut away part of paint layer and part of the oxide film to expose metallic main body; using specific conversion coating solution to passivate the magnesium alloy object; and spraying UV curable paint on the surface of the magnesium alloy object to provide corrosion protection. The present invention also provides a high-gross magnesium alloy structure.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 16, 2021
    Inventors: Hsiang-Jui WANG, Shun-Jie YANG, Cheng-Ping HSIAO
  • Patent number: 8154530
    Abstract: A touch panel includes a transparent substrate having a surface, a plurality of first touch sensor pads arrayed in a matrix on the surface, a plurality of second touch sensor pads arrayed in a matrix and staggered between the plurality of first touch sensor pads, a dielectric layer disposed upon the plurality of first touch sensor pads and the plurality of second touch sensor pads, a plurality of third touch sensor pads arrayed in a matrix on the dielectric layer, and a plurality of fourth touch sensor pads arrayed in a matrix on the dielectric layer and staggered between the plurality of third touch sensor pads. Each first touch sensor pad includes a first hollowed-out pattern, and each third touch sensor pad includes a second hollowed-out pattern and a solid portion formed around the second hollowed-out pattern, wherein a portion of the solid portion of each third touch sensor pad and a portion of the hollowed-out pattern of the first touch sensor pad overlap.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: April 10, 2012
    Assignee: RitFast Corporation
    Inventors: Hsien Chang Lin, Hsiang Jui Wang
  • Publication number: 20100321308
    Abstract: A touch panel includes a transparent substrate having a surface, a plurality of first touch sensor pads arrayed in a matrix on the surface, a plurality of second touch sensor pads arrayed in a matrix and staggered between the plurality of first touch sensor pads, a dielectric layer disposed upon the plurality of first touch sensor pads and the plurality of second touch sensor pads, a plurality of third touch sensor pads arrayed in a matrix on the dielectric layer, and a plurality of fourth touch sensor pads arrayed in a matrix on the dielectric layer and staggered between the plurality of third touch sensor pads. Each first touch sensor pad includes a first hollowed-out pattern, and each third touch sensor pad includes a second hollowed-out pattern and a solid portion formed around the second hollowed-out pattern, wherein a portion of the solid portion of each third touch sensor pad and a portion of the hollowed-out pattern of the first touch sensor pad overlap.
    Type: Application
    Filed: August 21, 2009
    Publication date: December 23, 2010
    Applicant: RITDISPLAY CORPORATION
    Inventors: HSIEN CHANG LIN, HSIANG JUI WANG
  • Patent number: 6698940
    Abstract: A method for assembling an optical assembly including a base member and a receptacle is disclosed. The base member retains a light source such as a laser diode therein, and has a first junction surface. The receptacle retains an optic fiber therein and has a second junction surface. The method includes the steps of: bringing the receptacle and the base member together with the junction surfaces engaging each other, adjusting the relative position between the base member and receptacle to obtain the best alignment therebetween, applying a heat curable adhesive between the junction surfaces, heating the adhesive by means of a heating device, the heating device having an annular portion surrounding the optical assembly proximate to the junction surfaces whereby the adhesive is cured to secure the base member and the receptacle together. The annular portion of the heating device includes a pipe forming a plurality of nozzles for directing streams of heated air toward the adhesive.
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: March 2, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chungyung Wang, HungLun Chang, Hsiang-Jui Wang
  • Patent number: 6524018
    Abstract: An optical assembly includes a light source, a support member and a receptacle. The support member is made of plastic, forming a first junction surface. The light source is contained in the support member. The receptacle is made of metal or plastic forming a second junction surface. The receptacle is attached to the support member with the second junction surface positioned on the first junction surface. A resistance wire is positioned in the support member surrounding the aperture and proximate the first junction surface. Two terminals of the wire extend outside the support member for being coupled to an external power source. To assemble the optical assembly, the receptacle and the support member are mounted in an aligning apparatus which operates to adjust the relative position between the receptacle and the support member.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: February 25, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chung Yung Wang, Hung Lun Chang, Hsiang-Jui Wang
  • Publication number: 20020150355
    Abstract: A method for assembling an optical assembly including a base member and a receptacle is disclosed. The base member retains a light source such as a laser diode therein, and has a first junction surface. The receptacle retains an optic fiber therein and has a second junction surface. The method includes the steps of: bringing the receptacle and the base member together with the junction surfaces engaging each other, adjusting the relative position between the base member and receptacle to obtain the best alignment therebetween, applying a heat curable adhesive between the junction surfaces, heating the adhesive by means of a heating device, the heating device having an annular portion surrounding the optical assembly proximate to the junction surfaces whereby the adhesive is cured to secure the base member and the receptacle together. The annular portion of the heating device includes a pipe forming a plurality of nozzles for directing streams of heated air toward the adhesive.
    Type: Application
    Filed: April 11, 2001
    Publication date: October 17, 2002
    Inventors: Chungyung Wang, HungLun Chang, Hsiang-Jui Wang
  • Publication number: 20020122638
    Abstract: An optical assembly includes a light source, a support member and a receptacle. The support member is made of plastic, forming a first junction surface. The light source is contained in the support member. The receptacle is made of metal or plastic forming a second junction surface. The receptacle is attached to the support member with the second junction surface positioned on the first junction surface. A resistance wire is positioned in the support member surrounding the aperture and proximate the first junction surface. Two terminals of the wire extend outside the support member for being coupled to an external power source. To assemble the optical assembly, the receptacle and the support member are mounted in an aligning apparatus which operates to adjust the relative position between the receptacle and the support member.
    Type: Application
    Filed: March 1, 2001
    Publication date: September 5, 2002
    Inventors: Chung Yung Wang, Hung Lun Chang, Hsiang-Jui Wang