Abstract: The present disclosure provides a method for fabricating an image sensor. The method includes the following operations. A cavity is formed at a first surface of a substrate. A germanium layer is formed in the cavity. A first heavily doped region is formed in the germanium layer by an implantation operation. A second heavily doped region is formed at a position proximal to a top surface of the germanium layer, wherein the second heavily doped region is laterally surrounded by the first heavily doped region from a top view perspective. An interconnect structure is formed over the germanium layer.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: Germanium-based sensors are disclosed herein. An exemplary germanium-based sensor includes a germanium photodiode and a junction field effect transistor (JFET) formed from a germanium layer disposed on and/or in a silicon substrate. A doped silicon layer, which can be formed by in-situ doping epitaxially grown silicon, is disposed between the germanium layer and the silicon substrate. In embodiments where the germanium layer is on the silicon substrate, the doped silicon layer is disposed between the germanium layer and an oxide layer. The JFET has a doped polysilicon gate, and in some embodiments, a gate diffusion region is disposed in the germanium layer under the doped polysilicon gate. In some embodiments, a pinned photodiode passivation layer is disposed in the germanium layer. In some embodiments, a pair of doped regions in the germanium layer is configured as an e-lens of the germanium-based sensor.

Abstract: A camera module includes a lens module, an image sensor, a circuit board for supporting the image sensor, and a lens holder for connecting the lens module and the circuit board. A method for fabricating the camera module includes the following steps. Firstly, at least one cleaning hole is created in the lens holder, and the at least one cleaning hole is filled with a removable sealing stuff. Then, the printed circuit board, the image sensor, the lens holder and the lens module of the camera module are combined together. Then, a testing procedure is performed to detect whether any pollutant is present within the assembled camera module. Once any pollutant within the assembled camera module is detected, the sealing stuff is removed from the at least one cleaning hole, a cleaning procedure is done to remove the pollutant, and the at least one cleaning hole is sealed again.

Abstract: A long-distance PoE power sourcing equipment includes a PoE local power supply, a PoE remote switch, and a link cable linked therebetween. The PoE local power supply serves as a conversion medium between a network signal and a first transmission signal and sources a first DC power to the PoE remote switch through the link cable. The PoE remote switch serves as a conversion medium between the first transmission signal and a second transmission signal and converts the first DC power into a second DC power supplied to a PoE power device through an Ethernet cable. The power transmission implemented by the PoE local power supply and the link cable allows the data and power transmission distance of the PoE system to exceed the distance limitation of the Ethernet specification.

Abstract: A camera module includes a lens module, an image sensor, a circuit board for supporting the image sensor, and a lens holder for connecting the lens module and the circuit board. A method for fabricating the camera module includes the following steps. Firstly, at least one cleaning hole is created in the lens holder, and the at least one cleaning hole is filled with a removable sealing stuff. Then, the printed circuit board, the image sensor, the lens holder and the lens module of the camera module are combined together. Then, a testing procedure is performed to detect whether any pollutant is present within the assembled camera module. Once any pollutant within the assembled camera module is detected, the sealing stuff is removed from the at least one cleaning hole, a cleaning procedure is done to remove the pollutant, and the at least one cleaning hole is sealed again.

Abstract: Disclosed is a system and method for connection of host behind network address translators. The system includes a server placed in a public network, and a transparent middleware (TMW). The server records the related data between each host and one or more NAT devices. The TMW may be performed in each host. When a first host of a first NAT device tries to establish connection to a second host of a second NAT device, through the server, the TMW looks up a first IP address mapping from the first host to the second NAT device, and a second IP address mapping from the second host to the first NAT device. Accordingly, the TMW accomplishes the support for establishing connection between the first and the second hosts.