Patents by Inventor Hsiang Kao

Hsiang Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250243291
    Abstract: The invention concerns methods and means for preventing the reduction of disulfide bonds during the recombinant production of disulfide-containing polypeptides. In particular, the invention concerns the prevention of disulfide bond reduction during harvesting of disulfide-containing polypeptides, including antibodies, from recombinant host cell cultures.
    Type: Application
    Filed: November 8, 2024
    Publication date: July 31, 2025
    Applicant: Genentech, Inc.
    Inventors: Yung-Hsiang KAO, Michael W. LAIRD, Melody Trexler SCHMIDT, Rita L. WONG, Daniel P. HEWITT
  • Publication number: 20250216764
    Abstract: An EUV lithography mask including a substrate, a patterned absorber layer including an alloy of rhodium. In some embodiments, the alloy of rhodium includes a group 5, group 6, group 9, group 10, or group 11 transition metal having a specific EUV refractive index and a specific EUV extinction coefficient. The disclosed EUV lithography masks reduce undesirable mask 3D effects.
    Type: Application
    Filed: March 22, 2024
    Publication date: July 3, 2025
    Inventors: Pei-Cheng HSU, Sih-Wei CHANG, Hsuan-I WANG, Yu-Hsiang KAO, Ching-Fang YU, Hsin-Chang LEE
  • Publication number: 20250192122
    Abstract: A package structure includes a first layer, a second layer and a third layer. The second layer includes an outer frame, a resonator and a chip. The second layer is arranged between the first layer and the third layer. The outer frame, the first layer and the third layer are constituted a rectangular accommodation portion. The resonator and the chip are located in the rectangular accommodation portion. The chip is located at a side of the resonator, and is electrically connected to the third layer and the resonator through a plurality of conductive components on the chip. A package structure in which the chip is located below the resonator is also provided.
    Type: Application
    Filed: January 4, 2024
    Publication date: June 12, 2025
    Applicant: TXC Corporation
    Inventors: Shih-Yung Pao, Chih-Hsun Chen, Tzu-Hsiu Peng, Sheng-Hsiang Kao
  • Patent number: 12293970
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate and a metallization layer. The metallization layer is disposed over the substrate. The metallization layer includes a first signal line, a second signal line, and a third signal line, wherein the first signal line, the second signal line, and the third signal line are arranged in a first row between a power rail and a ground rail parallel to the power rail. A first distance between the first signal line and the second signal line is different from a second distance between the second signal line and the third signal line. A method for manufacturing a semiconductor structure is also provided.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 6, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shih-Hsiang Kao, Chi-Wen Chang
  • Publication number: 20250125505
    Abstract: An electronic device includes a battery module, a battery connector and a controller is provided. The battery connector includes a first connector and a second connector. The first connector is installed on the battery module and includes a first metal component and an enable pin. The first metal component is disposed on a housing of the first connector and is coupled to the enable pin. The second connector includes a second metal component, a detection pin and a ground pin. The second metal component is disposed on a housing of the second connector. The detection pin is coupled to the second metal component. The ground pin is coupled to a ground potential and its position corresponds to the position of the enable pin. The controller determines a connection status of the first connector and the second connector according to an external signal on the detection pin.
    Type: Application
    Filed: August 11, 2024
    Publication date: April 17, 2025
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Hao-Hsuan Lin, Yu-Hsiu Su, Yu-Cheng Shen, Shih-Hsiang Kao, Wan-Ling Wong, Min-Che Kao, Yu-Lung Wu, Yen-Po Liao
  • Publication number: 20250123106
    Abstract: A measurement module is adapted to be disposed in a target object, including a corner prism space and multiple measurement units. The corner prism space includes two bottom surfaces opposite to each other and multiple side surfaces. The measurement units are disposed on the side surfaces of the corner prism space respectively. Each of the measurement units has a positioning reference axis perpendicular to the corresponding side surface. A number of the measurement units is the same as a number of the side surfaces, and the number of the measurement units is at least five.
    Type: Application
    Filed: September 19, 2024
    Publication date: April 17, 2025
    Applicant: Qisda Corporation
    Inventor: Chien-Hsiang Kao
  • Publication number: 20250084181
    Abstract: The present application discloses variants of Pertuzumab. In particular, it discloses: an unpaired cysteine variant comprising Cys23/Cys88 unpaired cysteines in one or both variable light domains of Pertuzumab, an afucosylated variant of Pertuzumab, a low-molecular-weight-species (LMWS) of Pertuzumab, and a high-molecular-weight-species (HMWS) or Pertuzumab. The application further discloses the isolated variants, compositions, pharmaceutical compositions, and articles of manufacture comprising the variants, as well as methods of making and characterizing the variants and compositions thereof.
    Type: Application
    Filed: October 14, 2024
    Publication date: March 13, 2025
    Applicant: Genentech, Inc.
    Inventors: Lynn A. Gennaro, Yung-Hsiang Kao, Yonghua Zhang
  • Publication number: 20250051201
    Abstract: A system for the treatment of oxidizable contaminants in wastewater includes a contaminant treatment vessel and a hydrogen peroxide supply unit. The hydrogen peroxide supply unit includes a hydrogen peroxide transfer line in fluid communication with the contaminant treatment vessel with an air-gap. A wastewater feed stream may also be in fluid communication with the contaminant treatment vessel. A contaminant treatment vessel effluent stream may also be in fluid communication with the contaminant treatment vessel. A method for the treatment of oxidizable contaminants in wastewater includes supplying wastewater to a contaminant treatment vessel, supplying hydrogen peroxide to the contaminant treatment vessel so that the supply is above the maximum filling level of the vessel in an air-gap, and contacting wastewater in the contaminant treatment vessel with hydrogen peroxide.
    Type: Application
    Filed: November 17, 2022
    Publication date: February 13, 2025
    Applicant: Dow Global Technologies LLC
    Inventors: Wu Chen, Lin Zhao, Jen-Hsiang Kao, Michael E. Uhl
  • Publication number: 20250044678
    Abstract: The present disclosure provides a method and a non-transitory computer-readable medium for generating layout based on path labeled with marker. The method includes: generating a first layout, wherein the first layout includes a plurality of paths; labeling a first path in the first layout with a first marker or a second marker; and generating a second layout by performing an optical proximity correction operation to the first layout, wherein a second path in the second layout corresponds to the first path in the first layout, the second path is not corrected during the optical proximity correction operation when the first path is labeled with the first marker, and the second path is corrected during the optical proximity correction operation when the first path is labeled with the second marker.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: CHUN-YAO KU, WEN-HAO CHEN, YUEH-LING HSU, SHIH-HSIANG KAO
  • Publication number: 20250007456
    Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit generates a clock signal and adjust a clock frequency of the clock signal according to a control voltage generated by the processor circuit. The processor circuit calculates a current frequency aging rate value based on a current clock frequency. The processor circuit calculates a control voltage regulation rate value based on the current frequency aging rate value and a control voltage slope, and compensates the control voltage based on the control voltage regulation rate value in the holdover state. Alternatively, the processor circuit calculates a frequency regulation value based on the current frequency aging rate value and an oscillator resolution of the synchronizer, and provides the frequency regulation value to the synchronizer in the holdover state to compensate an output frequency of the synchronizer.
    Type: Application
    Filed: September 12, 2024
    Publication date: January 2, 2025
    Applicant: TXC Corporation
    Inventors: Wan-Lin Hsieh, Wen-Cheng Wang, Sheng-Hsiang Kao
  • Publication number: 20240425610
    Abstract: The invention concerns methods and means for preventing the reduction of disulfide bonds during the recombinant production of disulfide-containing polypeptides. In particular, the invention concerns the prevention of disulfide bond reduction during harvesting of disulfide-containing polypeptides, including antibodies, from recombinant host cell cultures.
    Type: Application
    Filed: September 4, 2024
    Publication date: December 26, 2024
    Applicant: Genentech, Inc.
    Inventors: Yung-Hsiang KAO, Michael W. LAIRD, Melody Trexler SCHMIDT, Rita L. WONG, Daniel P. HEWITT
  • Patent number: 12173080
    Abstract: The invention concerns methods for preventing the reduction of disulfide bonds during the recombinant production of disulfide-containing polypeptides. In particular, the invention concerns the prevention of disulfide bond reduction during harvesting of disulfide-containing polypeptides, including antibodies, from recombinant host cell cultures.
    Type: Grant
    Filed: September 4, 2024
    Date of Patent: December 24, 2024
    Assignee: Genentech, Inc.
    Inventors: Yung-Hsiang Kao, Michael W. Laird, Melody Trexler Schmidt, Rita L. Wong, Daniel P. Hewitt
  • Patent number: 12145998
    Abstract: The present application discloses variants of Pertuzumab. In particular, it discloses: an unpaired cysteine variant comprising Cys23/Cys88 unpaired cysteines in one or both variable light domains of Pertuzumab, an afucosylated variant of Pertuzumab, a low-molecular-weight-species (LMWS) of Pertuzumab, and a high-molecular-weight-species (HMWS) or Pertuzumab. The application further discloses the isolated variants, compositions, pharmaceutical compositions, and articles of manufacture comprising the variants, as well as methods of making and characterizing the variants and compositions thereof.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: November 19, 2024
    Assignee: Genentech, Inc.
    Inventors: Lynn A. Gennaro, Yung-Hsiang Kao, Yonghua Zhang
  • Patent number: 12145997
    Abstract: The invention concerns methods for preventing the reduction of disulfide bonds during the recombinant production of disulfide-containing polypeptides. In particular, the invention concerns the prevention of disulfide bond reduction during harvesting of disulfide-containing polypeptides, including antibodies, from recombinant host cell cultures.
    Type: Grant
    Filed: April 26, 2024
    Date of Patent: November 19, 2024
    Assignee: Genentech, Inc.
    Inventors: Yung-Hsiang Kao, Michael W. Laird, Melody Trexler Schmidt, Rita L. Wong, Daniel P. Hewitt
  • Publication number: 20240379555
    Abstract: A method for manufacturing a semiconductor structure is provided. The method includes the operations as follows. A hard mask (HM) layer is formed over a dielectric layer over a substrate. A plurality of mandrels are formed over the HM layer. A spacer layer including a plurality of trenches between the mandrels is formed over the HM layer and the mandrels. A first and a second portion of the trenches is filled by a first and a second block material, respectively. A third portion of the trenches is free from filled by these block materials. At least a first opening is formed in the spacer layer. At least a second opening is formed by removing a portion of the mandrels. The HM layer is etched through the first and the second openings. The dielectric layer is patterned. A plurality of conductive lines are formed in the patterned dielectric layer.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: SHIH-HSIANG KAO, CHI-WEN CHANG
  • Patent number: 12117865
    Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit is configured to generate a clock signal and adjust a clock frequency of the clock signal according to a control voltage. The processor circuit is coupled to the oscillator circuit and is configured to generate the control voltage. The processor circuit reads a frequency aging rate value and a control voltage slope of the oscillator circuit from the oscillator circuit, calculates a control voltage regulation rate value corresponding to the frequency aging rate value and the control voltage slope, and compensates the control voltage based on the control voltage regulation rate value. Alternatively, the processor circuit reads the control voltage regulation rate value from the oscillator circuit, and compensates the control voltage based on the control voltage regulation rate value.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: October 15, 2024
    Assignee: TXC Corporation
    Inventors: Wan-Lin Hsieh, Wen-Cheng Wang, Sheng-Hsiang Kao
  • Patent number: 12098211
    Abstract: The invention concerns methods and means for preventing the reduction of disulfide bonds during the recombinant production of disulfide-containing polypeptides. In particular, the invention concerns the prevention of disulfide bond reduction during harvesting of disulfide-containing polypeptides, including antibodies, from recombinant host cell cultures.
    Type: Grant
    Filed: March 31, 2023
    Date of Patent: September 24, 2024
    Assignee: Genentech, Inc.
    Inventors: Yung-Hsiang Kao, Michael W. Laird, Melody Trexler Schmidt, Rita L. Wong, Daniel P. Hewitt
  • Publication number: 20240301080
    Abstract: The invention concerns methods and means for preventing the reduction of disulfide bonds during the recombinant production of disulfide-containing polypeptides. In particular, the invention concerns the prevention of disulfide bond reduction during harvesting of disulfide-containing polypeptides, including antibodies, from recombinant host cell cultures.
    Type: Application
    Filed: April 26, 2024
    Publication date: September 12, 2024
    Applicant: Genentech, Inc.
    Inventors: Yung-Hsiang KAO, Michael W. LAIRD, Melody Trexler SCHMIDT, Rita L. WONG, Daniel P. HEWITT
  • Publication number: 20240213103
    Abstract: A chip-assisted design device and a method for constructing a chip characteristic distribution model. The apparatus includes a database and a processor. The database has a first chip characteristic distribution image data generated based on a wafer fabrication process data of a current process, wherein the first chip characteristic distribution image data represents a gradient distribution of at least one chip characteristic in one of the wafers produced through current fabrication process. The processor is coupled to the database. A second chip characteristic image data generated based on the first chip characteristic image data is used as a reference data for predicting the future wafer fabrication process, and the reference data is provided to the current fabrication process to evaluate or correct the first chip characteristic image.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 27, 2024
    Applicant: DigWise Technology Corporation, LTD
    Inventors: Shih-Hao Chen, Chen-Hsiang Kao
  • Publication number: 20240201726
    Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit is configured to generate a clock signal and adjust a clock frequency of the clock signal according to a control voltage. The processor circuit is coupled to the oscillator circuit and is configured to generate the control voltage. The processor circuit reads a frequency aging rate value and a control voltage slope of the oscillator circuit from the oscillator circuit, calculates a control voltage regulation rate value corresponding to the frequency aging rate value and the control voltage slope, and compensates the control voltage based on the control voltage regulation rate value. Alternatively, the processor circuit reads the control voltage regulation rate value from the oscillator circuit, and compensates the control voltage based on the control voltage regulation rate value.
    Type: Application
    Filed: December 19, 2022
    Publication date: June 20, 2024
    Applicant: TXC Corporation
    Inventors: Wan-Lin Hsieh, Wen-Cheng Wang, Sheng-Hsiang Kao