Patents by Inventor Hsiang-Lin Lee

Hsiang-Lin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967591
    Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
  • Publication number: 20240096993
    Abstract: A method for tuning a threshold voltage of a transistor is disclosed. A channel layer is formed over a substrate. An interfacial layer is formed over and surrounds the channel layer. A gate dielectric layer is formed over and surrounds the interfacial layer. A dipole layer is formed over and wraps around the gate dielectric layer by performing a cyclic deposition etch process, and the dipole layer includes dipole metal elements and has a substantially uniform thickness. A thermal drive-in process is performed to drive the dipole metal elements in the dipole layer into the gate dielectric layer to form an interfacial dipole surface, and then the dipole layer is removed.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shen-Yang Lee, Hsiang-Pi Chang, Huang-Lin Chao
  • Patent number: 11489318
    Abstract: A distribution box includes a box body, a cover plate, and at least one guiding rail. The box body has several side plates and a base plate. An opening is formed by surrounding an end of each side plate. The base plate is connected to another end of each side plate. The cover plate is detachably engaged with the box body and closes the opening. The guiding rail is disposed inside the box body and has an open end facing toward the opening. At least one electrical accessory slides into the guiding rail from the open end and is engaged with the guiding rail. With the open end facing toward the opening, the electrical accessory could be easily disassembled and assembled without reserving an installation space at a position adjacent to the open end for providing other electrical accessories, which provides an effect of saving installation space.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: November 1, 2022
    Assignee: MOBILETRON ELECTRONICS CO., LTD.
    Inventor: Hsiang-Lin Lee
  • Publication number: 20210226424
    Abstract: A distribution box includes a box body, a cover plate, and at least one guiding rail. The box body has several side plates and a base plate. An opening is formed by surrounding an end of each side plate. The base plate is connected to another end of each side plate. The cover plate is detachably engaged with the box body and closes the opening. The guiding rail is disposed inside the box body and has an open end facing toward the opening. At least one electrical accessory slides into the guiding rail from the open end and is engaged with the guiding rail. With the open end facing toward the opening, the electrical accessory could be easily disassembled and assembled without reserving an installation space at a position adjacent to the open end for providing other electrical accessories, which provides an effect of saving installation space.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 22, 2021
    Applicant: MOBILETRON ELECTRONICS CO., LTD.
    Inventor: HSIANG-LIN LEE
  • Publication number: 20080181720
    Abstract: A joint positioning structure includes pivotally coupled first and second coupling members, and a locking mechanism. The locking mechanism includes a push rod moveably inserted through the first and second coupling members, a positioning member affixed to the first coupling member and having a plurality of radial locating slots, a stop block fixedly fastened to the push rod, and two engagement members, which are affixed to the stop block and engaged into the locating slots of the positioning member to lock the first and second coupling members when the stop member is moved with the push rod to a first position or disengaged from the locating slots of the positioning member to unlock the first and second coupling members for allowing relative biasing between the two coupling members when the stop member is moved with the push rod to a second position.
    Type: Application
    Filed: January 29, 2007
    Publication date: July 31, 2008
    Applicant: MOBILETRON ELECTRONICS CO., LTD.
    Inventors: Hsiang-Lin Lee, Cheng-I Teng
  • Patent number: D817869
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 15, 2018
    Assignee: MOBILETRON ELECTRONICS CO., LTD.
    Inventors: Hsiang-Lin Lee, Wen-Yao Chi
  • Patent number: D856921
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: August 20, 2019
    Assignee: MOBILETRON ELECTRONICS CO., LTD.
    Inventors: Hsiang-Lin Lee, Wen-Yao Chi