Patents by Inventor Hsiang-Po Huang

Hsiang-Po Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961779
    Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).
    Inventors: Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
  • Publication number: 20080166624
    Abstract: A Li-ion battery pack includes a Li-ion battery, a protection circuit, and multiple plugs connectable to a power hand tool. The positive pole of the Li-ion battery and the DC supply terminal of the protection circuit are electrically connected to two contact pieces of one respective plug. The two contact pieces are short-circuited by the positive contact terminal of the power hand tool. The negative contact terminal of the power hand tool is connected to a negative-pole contact piece of one plug, so that when the potential difference between the positive and negative poles of the Li-ion battery surpasses the low voltage level defined by the protection circuit, the protection circuit switches on the connection between the negative pole of the Li-ion battery and the negative-pole contact piece for enabling the positive and negative contact terminals of the power hand tool to obtain DC power supply from the Li-ion battery.
    Type: Application
    Filed: January 5, 2007
    Publication date: July 10, 2008
    Applicant: MOBILETRON ELECTRONICS CO., LTD.
    Inventors: Cheng-I Teng, Hsiang-Po Huang, Huei-Jiun Chen
  • Patent number: D532667
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: November 28, 2006
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventors: Kim Y. C. Tsai, Ju-Chien Chen, Fu-Tasi Wu, Tung-Chin Kuo, Hsiang-Po Huang
  • Patent number: D534048
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: December 26, 2006
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventors: Kim Y. C. Tsai, Ju-Chien Chen, Fu-Tasi Wu, Tung-Chin Kuo, Hsiang-Po Huang
  • Patent number: D534406
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: January 2, 2007
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventors: Kim Y. C. Tsai, Ju-Chien Chen, Fu-Tasi Wu, Tung-Chin Kuo, Hsiang-Po Huang
  • Patent number: D534779
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: January 9, 2007
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventors: Kim Y. C. Tsai, Ju-Chien Chen, Fu-Tasi Wu, Tung-Chin Kuo, Hsiang-Po Huang
  • Patent number: D536943
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: February 20, 2007
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventors: Kim Y. C. Tsai, Ju-Chien Chen, Fu-Tasi Wu, Tung-Chin Kuo, Hsiang-Po Huang
  • Patent number: D536944
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: February 20, 2007
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventors: Kim Y. C. Tsai, Ju-Chien Chen, Fu-Tasi Wu, Tung-Chin Kuo, Hsiang-Po Huang
  • Patent number: D541740
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: May 1, 2007
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventors: Kim Y. C. Tsai, Ju-Chien Chen, Fu-Tasi Wu, Tung-Chin Kuo, Hsiang-Po Huang
  • Patent number: D560109
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: January 22, 2008
    Assignee: Mobiletron Electronics Co., Ltd.
    Inventor: Hsiang-Po Huang