Patents by Inventor Hsiang-Sheng Cheng

Hsiang-Sheng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150192
    Abstract: A semiconductor device with different configurations of gate structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a gate opening on the fin structure, forming a metallic oxide layer within the gate opening, forming a first dielectric layer on the metallic oxide layer, forming a second dielectric layer on the first dielectric layer, forming a work function metal (WFM) layer on the second dielectric layer, and forming a gate metal fill layer on the WFM layer. The forming the first dielectric layer includes depositing an oxide material with an oxygen areal density less than an oxygen areal density of the metallic oxide layer.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Pi CHANG, Chung-Liang Cheng, I-Ming Chang, Yao-Sheng Huang, Huang-Lin Chao
  • Patent number: 11978674
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first source/drain epitaxial feature formed over a substrate, a second source/drain epitaxial feature formed over the substrate, two or more semiconductor layers disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature, a gate electrode layer surrounding a portion of one of the two or more semiconductor layers, a first dielectric region disposed in the substrate and in contact with a first side of the first source/drain epitaxial feature, and a second dielectric region disposed in the substrate and in contact with a first side of the second source/drain epitaxial feature, the second dielectric region being separated from the first dielectric region by a substrate.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: I-Ming Chang, Jung-Hung Chang, Chung-Liang Cheng, Hsiang-Pi Chang, Yao-Sheng Huang, Huang-Lin Chao
  • Patent number: 6776850
    Abstract: A preventive maintenance tool which may be installed on a metal chemical vapor deposition (CVD) chamber to prevent escape of contaminating and toxic gases from the chamber interior during preventative maintenance (PM) cleaning of the chamber. The tool comprises a cylindrical tool body which fits to the lid O-ring of the chamber to form a gas-tight seal therewith; a vacuum line connector nipple extending from the body for connection to a vacuum line; and a lid panel rotatably mounted in the body and fitted with a pair of hinged closing panels for reversibly sealing the chamber and facilitating chamber cleaning.
    Type: Grant
    Filed: June 8, 2002
    Date of Patent: August 17, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Miao-Cheng Liao, Ying-Lang Wang, Hung-Hsin Liang, Hsiang-Sheng Cheng, Sheng-Te Shu, Chih-Yuan Yang
  • Publication number: 20030228751
    Abstract: A preventative maintenance tool which may be installed on a metal chemical vapor deposition (CVD) chamber to prevent escape of contaminating and toxic gases from the chamber interior during preventative maintenance (PM) cleaning of the chamber. The tool comprises a cylindrical tool body which fits to the lid O-ring of the chamber to form a gas-tight seal therewith; a vacuum line connector nipple extending from the body for connection to a vacuum line; and a lid panel rotatably mounted in the body and fitted with a pair of hinged closing panels for reversibly sealing the chamber and facilitating chamber cleaning.
    Type: Application
    Filed: June 8, 2002
    Publication date: December 11, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Miao-Cheng Liao, Ying-Lang Wang, Hung-Hsin Liang, Hsiang-Sheng Cheng, Sheng-Te Shu, Chih-Yuan Yang
  • Patent number: 6483082
    Abstract: A heater lift mechanism with a ball screw linear actuator provides a relatively maintenance free lift mechanism with low starting torque and high positional accuracy. The heater lift mechanism can also be used to move wafer boats in a vertical furnace. The ball screw linear actuator has substantially reduced backlash over a conventional ACME thread lead screw.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: November 19, 2002
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Miao-Cheng Liao, Hsiang-Sheng Cheng