Abstract: A memory operation method, comprising: when a first super block of a memory device is a open block (or in programming state), obtaining a first read count of one of a plurality of first memory blocks in the first super block, wherein the first read count is a number of times that data of one of the first memory blocks is read out; determining whether the first read count is larger than a first threshold; and when the first read count is larger than the first threshold, moving a part of the data in the first super block to a safe area in the memory device, wherein the part of the data comprises data in the first memory block.

Abstract: A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.

Abstract: A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.

Abstract: An exemplary insert-molded cover (10) for electronic devices includes a metallic body (11), a plastic antenna lid (12) integrally formed with the metallic body and an oxide film (12) formed on a surface (111) of the metallic body for attaching the plastic antenna lid. The present invention also relates a method for manufacturing the insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for electronic devices. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed with the metallic body. The metallic body includes a joining area (13) on an edge of the metallic body, the plastic antenna lid includes at least two portions (12a, 12b) formed in the joining area correspondingly. The present invention also relates to a method for manufacturing an insert-molded cover for electronic devices.

Abstract: An exemplary insert-molded cover (10) for electronic devices includes a metallic body (11), a plastic antenna lid (12) integrally formed with the metallic body and an oxide film (12) formed on a surface (111) of the metallic body for attaching the plastic antenna lid. The present invention also relates a method for manufacturing the insert-molded cover for electronic devices.

Abstract: An exemplary joining structure, used for insert-molded covers, includes a metallic portion (131), a plastic portion (132) integrally formed with the metallic portion, and an adhesive film (133) formed between the metallic portion and the plastic portion. The metallic portion and the plastic portion are bonded together by the adhesive film. The present invention also relates an insert-molded cover (10) for electronic devices using the joining structure and a method for manufacturing the insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for a electronic device. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed on an edge of the metallic body. At least one latching structure (13, 14, 15, 16) is formed on a boundary of the metallic body and the plastic antenna lid. The present invention also relates a method for manufacturing an insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for a electronic device. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed on an edge of the metallic body. An outer surface (101) of a junction of the metallic body and the plastic antenna lid is smooth and painted by a coating (13). The present invention also relates a method for manufacturing an insert-molded cover for electronic devices.