Patents by Inventor HSIANG-SHENG WEN
HSIANG-SHENG WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190059971Abstract: A tumor ablation system includes a heating needle and a power supply device. The heating needle includes a rigid tubular shell. The heating needle further includes a heating element and a non-heating element; the heating element has at least one heating wire, a central cylindrical object and a distal part of the shell. The heating wire and the central cylindrical object are inside the shell. The heating wire is electrically coupled to the non-heating element, and coiled on the central cylindrical object. The distal part of the shell covers the coil formed by the heating wire on the central cylindrical object. When the heating wire is charged with electricity the heating wire generates thermal energy that is conducted to the distal part of the shell. The power supply device couples to the non-heating element, and provides electricity to the heating needle.Type: ApplicationFiled: May 10, 2017Publication date: February 28, 2019Inventors: SHENG-CHIEH HUANG, HSIANG-SHENG WEN, TSUNG-FU YANG, CHUNG-CHUN LIAO
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Patent number: 8735738Abstract: A printed circuit board grounding structure for use with a communication apparatus is configured for use with a printed circuit board to contact a grounded casing and thereby form a grounded circuit capable of electromagnetic wave shielding. The printed circuit board ground structure includes a copper conductive layer and a plurality of solder contacts. The copper conductive layer is circumferentially disposed along the periphery of the printed circuit board. The solder contacts are disposed on the copper conductive layer and used for electrically contacting with the casing. The printed circuit board grounding structure prevents deterioration of electromagnetic wave shielding despite oxidation of the copper conductive layer. The circumferentially-disposed copper conductive layer blocks electromagnetic wave generated from inside the printed circuit board, prevents leakage of the electromagnetic wave, and ultimately prevents the electromagnetic wave from interfering with other electronic apparatuses.Type: GrantFiled: January 5, 2011Date of Patent: May 27, 2014Assignee: Askey Computer Corp.Inventors: Hsiang-Sheng Wen, Ching-Feng Hsieh
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Patent number: 8508951Abstract: A method for laying out a printed circuit board for use in a gigabit-capable passive optical network includes the steps of providing a printed circuit board and laying out an analog circuit module, an analog-to-digital conversion module, a signal processing module, an optoelectronic transmitting and receiving module, and a power module on the printed circuit board. The printed circuit board has a first periphery and an opposing second periphery. The analog circuit module and the optoelectronic transmitting and receiving module are laid out at the first periphery of the printed circuit board. The power module is laid out at the second periphery of the printed circuit board. Electromagnectic wave generated by a power IC inserted in the power module does not interfere with data transmission taking place at the optoelectronic transmitting and receiving module. Furthermore, a printed circuit board for use with the method is proposed.Type: GrantFiled: January 5, 2011Date of Patent: August 13, 2013Assignee: Askey Computer Corp.Inventors: Hsiang-Sheng Wen, Ching-Feng Hsieh
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Publication number: 20120294341Abstract: A hybrid circuit for a Very-High-Speed Digital Subscriber Line (VDSL) blocks noise and includes a transceiving unit, a voltage transformation module, a direct current (DC) blocking capacitor, a receiving unit, and a transmitting unit. The voltage transformation module blocks noise generated as a result of transmission of an upstream signal and a downstream signal at the transceiving unit, and includes a first voltage transformation unit and a second voltage transformation unit. The DC blocking capacitor is series-connected between primary coils of the first and second voltage transformation units for preventing the direct current in the VDSL from affecting the transmission of the upstream signal and the downstream signal. Accordingly, the hybrid circuit simplifies the circuit design of the VDSL, cuts costs incurred by electronic components, and reduces the area required for circuit layout.Type: ApplicationFiled: June 28, 2011Publication date: November 22, 2012Inventors: HSIANG-SHENG WEN, CHING-FENG HSIEH
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Publication number: 20120181067Abstract: A circuit board includes a substrate, a first copper layer, a first solder mask, a second copper layer, and a second solder mask. The substrate has a first surface, an opposing second surface, and a conductive portion bypassing a laid-out circuit and passing through the first and second surfaces. The first and second copper layers are disposed on the first and second surfaces and connected to the conductive portion, respectively. The first and second solder masks are disposed on the first and second copper layers and provided with a first opening corresponding in position to a power component and a second opening for exposing the conductive portion and a portion of the second copper layer, respectively. Heat generated by the power component is transferred by the conductive portion to the second copper layer through the first copper layer and then dissipated to the outside through the second opening, better.Type: ApplicationFiled: March 4, 2011Publication date: July 19, 2012Applicant: ASKEY COMPUTER CORP.Inventors: HSIANG-SHENG WEN, CHING-FENG HSIEH
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Publication number: 20120146737Abstract: A multiple-output clock source signal generator for use with a fiber-optic communication apparatus for multi-dwelling units (MDU) includes a piezoelectric crystal, an input capacitor, an output capacitor, and a buffer unit having output ends. The piezoelectric crystal, the input capacitor, and the output capacitor are connected to the buffer unit so as to form a feedback circuit whereby the piezoelectric crystal oscillates and generates clock source signals to be output from the output ends, respectively. The multiple-output clock source signal generator is advantageously characterized by low costs and multiple output.Type: ApplicationFiled: January 20, 2011Publication date: June 14, 2012Applicant: ASKEY COMPUTER CORP.Inventors: HSIANG-SHENG WEN, CHING-FENG HSIEH
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Publication number: 20120145439Abstract: A printed circuit board grounding structure for use with a communication apparatus is configured for use with a printed circuit board to contact a grounded casing and thereby form a grounded circuit capable of electromagnetic wave shielding. The printed circuit board ground structure includes a copper conductive layer and a plurality of solder contacts. The copper conductive layer is circumferentially disposed along the periphery of the printed circuit board. The solder contacts are disposed on the copper conductive layer and used for electrically contacting with the casing. The printed circuit board grounding structure prevents deterioration of electromagnetic wave shielding despite oxidation of the copper conductive layer. The circumferentially-disposed copper conductive layer blocks electromagnetic wave generated from inside the printed circuit board, prevents leakage of the electromagnetic wave, and ultimately prevents the electromagnetic wave from interfering with other electronic apparatuses.Type: ApplicationFiled: January 5, 2011Publication date: June 14, 2012Applicant: ASKEY COMPUTER CORP.Inventors: HSIANG-SHENG WEN, CHING-FENG HSIEH
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Publication number: 20120147568Abstract: A method for laying out a printed circuit board for use in a gigabit-capable passive optical network includes the steps of providing a printed circuit board and laying out an analog circuit module, an analog-to-digital conversion module, a signal processing module, an optoelectronic transmitting and receiving module, and a power module on the printed circuit board. The printed circuit board has a first periphery and an opposing second periphery. The analog circuit module and the optoelectronic transmitting and receiving module are laid out at the first periphery of the printed circuit board. The power module is laid out at the second periphery of the printed circuit board. Electromagnetic wave generated by a power IC inserted in the power module does not interfere with data transmission taking place at the optoelectronic transmitting and receiving module. Furthermore, a printed circuit board for use with the method is proposed.Type: ApplicationFiled: January 5, 2011Publication date: June 14, 2012Applicant: ASKEY COMPUTER CORP.Inventors: HSIANG-SHENG WEN, CHING-FENG HSIEH