Patents by Inventor Hsiang Wan Liau

Hsiang Wan Liau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Void reduction in indium thermal interface material
    Patent number: 7999394
    Abstract: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: August 16, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master
  • Void Reduction in Indium Thermal Interface Material
    Publication number: 20100117222
    Abstract: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
    Type: Application
    Filed: December 15, 2009
    Publication date: May 13, 2010
    Inventors: Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master
  • Void reduction in indium thermal interface material
    Patent number: 7651938
    Abstract: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: January 26, 2010
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master
  • Double-sided waffle pack
    Patent number: 7482697
    Abstract: Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: January 27, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Soon Tatt Ow Yong, Hsiang Wan Liau, Yeow Guan Teh
  • Double-Sided Waffle Pack
    Publication number: 20080029904
    Abstract: Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.
    Type: Application
    Filed: August 2, 2006
    Publication date: February 7, 2008
    Inventors: Soon Tatt Ow Yong, Hsiang Wan Liau, Yeow Guan Teh
  • Void Reduction in Indium Thermal Interface Material
    Publication number: 20070284737
    Abstract: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
    Type: Application
    Filed: June 7, 2006
    Publication date: December 13, 2007
    Inventors: Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master