Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.

Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a dielectric layer including a top surface, a plurality of magneto-resistive memory cells disposed in the dielectric layer and including top electrodes, a first etch stop layer disposed over the dielectric layer, a common electrode extending through the first etch stop layer to be in direct contact with the top electrodes, and a second etch stop layer disposed on the first etch stop layer and the common electrode. Top surfaces of the top electrodes are coplanar with the top surface of the dielectric layer.

Abstract: A method for making a foam component is provided and includes inserting a foam material into a cavity of a mold having a top plate and a bottom plate, heating the foam material to cause the foam material to expand, and moving one of the top plate and the bottom plate relative to the other of the top plate and the bottom plate as the foam material expands and contacts the one of the top plate and the bottom plate to cause the foam material to fold over on itself within the cavity.

Abstract: A method for making a foam component is provided and includes inserting a foam material into a cavity of a mold having a top plate and a bottom plate, heating the foam material to cause the foam material to expand, and moving one of the top plate and the bottom plate relative to the other of the top plate and the bottom plate as the foam material expands and contacts the one of the top plate and the bottom plate to cause the foam material to fold over on itself within the cavity.

Abstract: A mobile cart includes a cabinet, wheels, drawers and an illumining unit. The wheels are disposed on a bottom of the cabinet. The drawers are disposed in the cabinet and configured to be pulled out of the cabinet. The drawers includes compartment drawers. The illumining unit is disposed on a top of the cabinet and includes a compartment drawer illumining module, wherein the compartment drawer illumining module is configured to illumine any one of the compartment drawers being pulled out of the cabinet.