Patents by Inventor HSIANG WEI LAI

HSIANG WEI LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MODULAR CONNECTION DEVICE
    Publication number: 20220074191
    Abstract: A modular connection device is provided. The modular connection device includes a base and a plurality of connection members. The base includes a plurality of connection surfaces, wherein each of the connection surfaces is connected with each other. Each of the connection members is detachably connected on each of the connection surfaces.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 10, 2022
    Inventor: HSIANG WEI LAI