Patents by Inventor Hsiangwen LIN

Hsiangwen LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9910951
    Abstract: Systems, methods, and other embodiments associated with mitigating wire capacitance are described. In one embodiment, a method includes loading, by at least a processor into an electronic memory, an electronic data structure that includes a design of an integrated circuit. The design defines layers of the integrated circuit and connections between structures and wire interconnects in the layers. The example method may also include generating, by at least the processor, a structured topology in the design by successively routing the wire interconnects throughout the layers according to coordinates of the structures in the design and weighted values associated with each of the structures to mitigate wire capacitance of the wire interconnects.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: March 6, 2018
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Kiran Vedantam, James G. Ballard, Hsiangwen Lin
  • Publication number: 20170053054
    Abstract: Systems, methods, and other embodiments associated with mitigating wire capacitance are described. In one embodiment, a method includes loading, by at least a processor into an electronic memory, an electronic data structure that includes a design of an integrated circuit. The design defines layers of the integrated circuit and connections between structures and wire interconnects in the layers. The example method may also include generating, by at least the processor, a structured topology in the design by successively routing the wire interconnects throughout the layers according to coordinates of the structures in the design and weighted values associated with each of the structures to mitigate wire capacitance of the wire interconnects.
    Type: Application
    Filed: August 20, 2015
    Publication date: February 23, 2017
    Inventors: Kiran VEDANTAM, James G. BALLARD, Hsiangwen LIN