Abstract: An electronic device is provided. The electronic device includes a housing and a thermal module. The housing includes an upper shell and a bottom shell. The thermal module is disposed inside the housing. The thermal module includes a first casing and a first block component. The first casing has a first wind opening. The first block component is disposed between the first casing and one of the upper shell or the bottom shell, and is disposed close to the first wind opening for preventing particles from entering the electronic device through the interval between the first casing and the housing.