Abstract: Semiconductor devices and methods of forming the same are provided. A method according to an embodiment includes receiving a substrate including a lower contact feature, depositing a first dielectric layer over a substrate, forming a metal-insulator-metal (MIM) structure over the first dielectric layer, depositing a second dielectric layer over the MIM structure, performing a first etch process to form an opening that extends through the second dielectric layer to expose the MIM structure, performing a second etch process to extend the opening through the MIM structure to expose the first dielectric layer; and performing a third etch process to further extend the opening through the first dielectric layer to expose the lower contact feature. Etchants of the first etch process and the third etch process include fluorine while the etchant of the second etch process is free of fluorine.

Abstract: Semiconductor devices and methods of forming the same are provided. A method according to an embodiment includes receiving a substrate including a lower contact feature, depositing a first dielectric layer over a substrate, forming a metal-insulator-metal (MIM) structure over the first dielectric layer, depositing a second dielectric layer over the MIM structure, performing a first etch process to form an opening that extends through the second dielectric layer to expose the MIM structure, performing a second etch process to extend the opening through the MIM structure to expose the first dielectric layer; and performing a third etch process to further extend the opening through the first dielectric layer to expose the lower contact feature. Etchants of the first etch process and the third etch process include fluorine while the etchant of the second etch process is free of fluorine.

Abstract: A lens structure is provided. The lens structure comprises a first barrel and a second barrel. The first barrel comprises a first pin and a second pin. The second barrel comprises a continuous groove. Wherein in a wide-angle end, the first pin is located in the continuous groove and the second pin is located outside of the second barrel. Wherein in a telephoto end, the first pin is located outside of the second barrel and the second pin is located in the continuous groove.

Abstract: A lens structure is provided. The lens structure comprises a first barrel, at least one guider and a second barrel. The first barrel has a first groove, and comprises a first pin. The guider is slidably set to the first groove. The guider comprises a main body, a first limiting portion and a second limit portion. The main body has a first end and a second end opposite to the first end. The first limiting portion is connected to the main body and located between the first end and the second end. The second limiting portion is connected to the second end. The second barrel moves with the guider through the first limiting portion and has a second groove to which the first pin of the first barrel is set.

Abstract: A semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; and a stress memorization technology (SMT) sidewall spacer over a sidewall of the gate stack. The gate stack includes a gate dielectric layer over the semiconductor substrate and a gate electrode over the gate dielectric layer. The SMT sidewall spacer provides a stress for a channel region beneath the gate stack.

Abstract: A semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; and a stress memorization technology (SMT) sidewall spacer over a sidewall of the gate stack. The gate stack includes a gate dielectric layer over the semiconductor substrate and a gate electrode over the gate dielectric layer. The SMT sidewall spacer provides a stress for a channel region beneath the gate stack.

Abstract: A lens module is disclosed. The lens module includes a lead screw, a nut member, and a lens frame. The nut member is screw-jointed with the lead screw. The nut member is interlocked to the lens frame.

Abstract: An optical lens device is disclosed. The optical lens device includes an optical lens, a shading film, and a sensor. The shading film is disposed within the optical lens, and the shading film has an opening. The sensor is disposed at an imaging position. Wherein at least one light beam which enters the optical lens will access to the sensor, or will be blocked by the shading film.