Patents by Inventor Hsiang-Yu Wu

Hsiang-Yu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240074761
    Abstract: An implantable rotator cuff muscle suture spacer with pressure sensing is provided, formed by a semiconductor manufacture procedure, including a base layer, made of a polymer material and having flexibility, and further including a first configuration region and a second configuration region, where the base layer is folded at imaginary fold line positions of the first configuration region and the second configuration region, so that the first configuration region is located above the second configuration region; a first electrode region, deposited on the first configuration region; a second electrode region, deposited on the second configuration region, corresponding to a position below the first electrode region, and configured to obtain a pressure sensing value; an inductance coil, deposited on the second configuration region and surrounding the second electrode region; and a capacitor layer, coated above a surface of the base layer to form a dielectric substance.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 7, 2024
    Inventors: WEN CHENG KUO, HSIANG-YU WU, SONG-CHENG HONG
  • Patent number: 11073852
    Abstract: An electronic load apparatus is provided and adapted to allow an enhanced driving circuit to be disposed between a voltage-dividing circuit and power components to ensure the driving capability of the power components not coupled to a control circuit to thereby adjust a response voltage quickly, shorten a response time period and thus increase overall response speed, suppress transient voltage variation and thus preclude a signal delay otherwise arising from a load circuit, allow the power components series-connected in an electronic load apparatus to be driven quickly, reduce the risk of damaging the power components, and enhance the stability and reliability of the electronic load apparatus.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: July 27, 2021
    Assignee: CHROMA ATE INC.
    Inventors: Chun-Sheng Hung, Hsiang-Yu Wu, Chi-Chiao Cheng, Chien-Hsing Huang
  • Publication number: 20210200251
    Abstract: An electronic load apparatus is provided and adapted to allow an enhanced driving circuit to be disposed between a voltage-dividing circuit and power components to ensure the driving capability of the power components not coupled to a control circuit to thereby adjust a response voltage quickly, shorten a response time period and thus increase overall response speed, suppress transient voltage variation and thus preclude a signal delay otherwise arising from a load circuit, allow the power components series-connected in an electronic load apparatus to be driven quickly, reduce the risk of damaging the power components, and enhance the stability and reliability of the electronic load apparatus.
    Type: Application
    Filed: November 6, 2020
    Publication date: July 1, 2021
    Inventors: Chun-Sheng Hung, Hsiang-Yu Wu, Chi-Chiao Cheng, Chien-Hsing Huang