Patents by Inventor Hsiang-Yun Chu

Hsiang-Yun Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method
    Patent number: 12028099
    Abstract: A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: July 2, 2024
    Assignee: MEDIATEK INC.
    Inventors: Jui-Lin Hsu, Hsiang-Yun Chu, Yen-Tso Chen, Jen-Hao Cheng, Wei-Hsiu Hsu, Tzu-Chin Lin, Chih-Ming Hung, Jing-Hong Conan Zhan
  • Semiconductor chip with local oscillator buffer reused for signal transmission and associated transmission method
    Patent number: 11695439
    Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: July 4, 2023
    Assignee: MEDIATEK INC.
    Inventors: Jui-Lin Hsu, Yen-Tso Chen, Hsiang-Yun Chu, Jen-Hao Cheng, Wei-Hsiu Hsu, Tzu-Chin Lin, Chih-Ming Hung, Jing-Hong Conan Zhan
  • SEMICONDUCTOR CHIP WITH LOCAL OSCILLATOR BUFFER REUSED FOR LOOP-BACK TEST AND ASSOCIATED LOOP-BACK TEST METHOD
    Publication number: 20230179240
    Abstract: A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.
    Type: Application
    Filed: February 1, 2023
    Publication date: June 8, 2023
    Applicant: MEDIATEK INC.
    Inventors: Jui-Lin Hsu, Hsiang-Yun Chu, Yen-Tso Chen, Jen-Hao Cheng, Wei-Hsiu Hsu, Tzu-Chin Lin, Chih-Ming Hung, Jing-Hong Conan Zhan
  • Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method
    Patent number: 11601147
    Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: March 7, 2023
    Assignee: MEDIATEK INC.
    Inventors: Jui-Lin Hsu, Hsiang-Yun Chu, Yen-Tso Chen, Jen-Hao Cheng, Wei-Hsiu Hsu, Tzu-Chin Lin, Chih-Ming Hung, Jing-Hong Conan Zhan
  • SEMICONDUCTOR CHIP WITH LOCAL OSCILLATOR BUFFER REUSED FOR LOOP-BACK TEST AND ASSOCIATED LOOP-BACK TEST METHOD
    Publication number: 20220140848
    Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.
    Type: Application
    Filed: October 18, 2021
    Publication date: May 5, 2022
    Applicant: MEDIATEK INC.
    Inventors: Jui-Lin Hsu, Hsiang-Yun Chu, Yen-Tso Chen, Jen-Hao Cheng, Wei-Hsiu Hsu, Tzu-Chin Lin, Chih-Ming Hung, Jing-Hong Conan Zhan
  • SEMICONDUCTOR CHIP WITH LOCAL OSCILLATOR BUFFER REUSED FOR SIGNAL TRANSMISSION AND ASSOCIATED TRANSMISSION METHOD
    Publication number: 20220140849
    Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.
    Type: Application
    Filed: October 19, 2021
    Publication date: May 5, 2022
    Applicant: MEDIATEK INC.
    Inventors: Jui-Lin Hsu, Yen-Tso Chen, Hsiang-Yun Chu, Jen-Hao Cheng, Wei-Hsiu Hsu, Tzu-Chin Lin, Chih-Ming Hung, Jing-Hong Conan Zhan