Abstract: Method for fabricating printed circuit board employing optical engraving and metallization techniques to form a pre-designated circuit pattern on a transfer plate, wherein the pattern is transferred and inlaid to a dielectric material by lamination, a printed circuit is emerged after removal of said transfer plate and surface copper deposit is etched off. PCB produced by the present invention and characterized by its outer layer circuitry is inlaid into the dielectric material, thus having 3-sided adhesion between the circuitry and the dielectric material.

Abstract: Printed circuit boards whose outerlayer circuit lines are inlaid into the dielectric layer thus have 3-side adhesion between circuitry and adjacent dielectric material. Method for fabricating said PCB, in particular method without using of copper clad laminate and/or copper foil to circumvent various difficulties arid shortcomings associated with using them. This invention employs optical engraving and pattern metallization techniques conducted on a metal transfer plate to form the circuit pattern, then transfer the pattern to a dielectric material via lamination technique, a printed circuit is emerged after removal of metal plate and etching away the covering copper foil. This invention is particularly useful in manufacturing very thin PCB with very fine line width and space.