Patents by Inventor Hsiao-Chi Lou

Hsiao-Chi Lou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system
    Patent number: 7092836
    Abstract: A method for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system is introduced to screen the complicated wiring state of the hi-fix structure and to pinpoint the wiring swap thereinside as well. The hi-fix structure has at least S socket slots for testing electronic devices which each of the electronic devices has at least R leads. The present method, firstly, is to prepare R test unit sets which each of the test unit set includes S identical lead-off elements. Then, all R test unit sets are tested, in order, on the hi-fix structure and the respective test results are recorded. Finally, by analyzing the test results, the wiring swap inside the hi-fix structure can be accurately located.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: August 15, 2006
    Assignee: Mosel Vitelic, Inc.
    Inventors: Hsiao-Chi Lou, Ween-Chen Lu
  • Method for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system
    Publication number: 20040167728
    Abstract: A method for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system is introduced to screen the complicated wiring state of the hi-fix structure and to pinpoint the wiring swap thereinside as well. The hi-fix structure has at least S socket slots for testing electronic devices which each of the electronic devices has at least R leads. The present method, firstly, is to prepare R test unit sets which each of the test unit set includes S identical lead-off elements. Then, all R test unit sets are tested, in order, on the hi-fix structure and the respective test results are recorded. Finally, by analyzing the test results, the wiring swap inside the hi-fix structure can be accurately located.
    Type: Application
    Filed: August 28, 2003
    Publication date: August 26, 2004
    Applicant: MOSEL VITELIC, INC.
    Inventors: Hsiao-Chi Lou, Ween-Chen Lu