Patents by Inventor Hsiao-Chiao Li

Hsiao-Chiao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8168992
    Abstract: A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: May 1, 2012
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chia-Hsien Chang, Yi-Tsuo Wu, Hsiao-Chiao Li
  • Patent number: 8093600
    Abstract: A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: January 10, 2012
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Hsiao-Chiao Li, Yi-Tsuo Wu
  • Publication number: 20110140157
    Abstract: A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.
    Type: Application
    Filed: February 24, 2011
    Publication date: June 16, 2011
    Applicant: EVERLIGHT ELECTRONICS CO., LTD
    Inventors: Chia-Hsien CHANG, Yi-Tsuo WU, Hsiao-Chiao LI
  • Publication number: 20110089449
    Abstract: An LED package structure includes a house, an LED chip, a transparent cover, and a surrounding wall. The house has an upper surface, a cavity exposed by the upper surface, and a surrounding plane. The LED chip is disposed on the bottom surface of the cavity. The transparent cover is disposed on the surrounding plane and the opening of the cavity is sealed by the transparent cover. The surrounding wall is disposed on the upper surface of the house and surrounds the transparent cover.
    Type: Application
    Filed: May 12, 2010
    Publication date: April 21, 2011
    Inventors: He-Mu Chou, Hsiao-Chiao Li, Chung-Chuan Hsieh
  • Patent number: 7919789
    Abstract: A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: April 5, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chia-Hsien Chang, Yi-Tsuo Wu, Hsiao-Chiao Li
  • Publication number: 20100052001
    Abstract: A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.
    Type: Application
    Filed: November 10, 2009
    Publication date: March 4, 2010
    Inventors: Hsiao-Chiao Li, Yi-Tsuo Wu
  • Patent number: 7635870
    Abstract: A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: December 22, 2009
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Hsiao-Chiao Li, Yi-Tsuo Wu
  • Publication number: 20090168403
    Abstract: A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.
    Type: Application
    Filed: December 24, 2008
    Publication date: July 2, 2009
    Inventors: Chia-Hsien CHANG, Yi-Tsuo Wu, Hsiao-Chiao Li
  • Publication number: 20090014739
    Abstract: The present invention is an improved Light-Emitting Diode (LED) package structure comprising a light-emitting diode chip, a package board of heat conductive semiconductor material, a lead frame, and a circuit. Whereon the package board installs plural thermal vias to conduct the electricity circuit and transmit the heat out of the package due to the LED luminescing as well.
    Type: Application
    Filed: May 2, 2008
    Publication date: January 15, 2009
    Inventors: Jen-Ta Chiang, Yi-Tsuo Wu, Chia-Hsien Chang, Hsiao-Chiao Li
  • Publication number: 20080017877
    Abstract: A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.
    Type: Application
    Filed: July 23, 2007
    Publication date: January 24, 2008
    Inventors: Hsiao-Chiao Li, Yi-Tsuo Wu