Patents by Inventor Hsiao Chih Chang

Hsiao Chih Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Antenna structure capable of transmitting a WiGig band and head-mounted wireless transmission display device
    Patent number: 11942680
    Abstract: An antenna structure capable of transmitting a WiGig band for a head-mounted wireless transmission display device including a display screen and an overhead device is disclosed. The antenna structure includes at least two body portions, each of the body portions having at least a signal transceiving end, the body portions are respectively arranged at left and right sides of the display screen, and signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen respectively.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 26, 2024
    Assignee: HTC CORPORATION
    Inventors: Sheng Cherng Lin, Hsiao-Ling Chan, Chen-Hao Chang, Chien-Chih Chen
  • Superimpose photomask and method of patterning
    Patent number: 8133661
    Abstract: Provided is a photomask that includes a substrate having a first region and a second region, a first pattern disposed in the first region of the substrate, and a second pattern disposed in the second region of the substrate. The first and second patterns are a decomposition of a design pattern to be transferred onto a wafer in a lithography process.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: March 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao Chih Chang, Dong-Hsu Cheng, Chih-Chiang Tu
  • SUPERIMPOSE PHOTOMASK AND METHOD OF PATTERNING
    Publication number: 20110091797
    Abstract: Provided is a photomask that includes a substrate having a first region and a second region, a first pattern disposed in the first region of the substrate, and a second pattern disposed in the second region of the substrate. The first and second patterns are a decomposition of a design pattern to be transferred onto a wafer in a lithography process.
    Type: Application
    Filed: October 21, 2009
    Publication date: April 21, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiao Chih Chang, Dong-Hsu Cheng, Chih-Chiang Tu