Patents by Inventor Hsiao-Chuan Lee

Hsiao-Chuan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9799497
    Abstract: Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: October 24, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Fang Chung, Chih-Tsang Tseng, Hsiao-Chuan Lee, Kuo-Pin Chuang, Shuen-Liang Tseng
  • Publication number: 20150047563
    Abstract: Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 19, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: CHEN-FANG CHUNG, Chih-Tsang Tseng, Hsiao-Chuan Lee, KUO-PIN CHUANG, Shuen-Liang Tseng