Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A capsule endoscope, an endoscope system, and an image correction method are provided. The capsule endoscope includes an image sensor and a posture sensor. The image sensor is coupled to a processor and obtains a sensed image. The posture sensor is coupled to the processor and obtains three-axis data. The processor calculates a screen rotation angle according to the three-axis data and corrects the sensed image according to the screen rotation angle. A first axis and a second axis of the corrected sensed image rotate toward an actual vertical axis and an actual horizontal axis.