Abstract: A method of lithography process is provided. The method includes forming a conductive layer over a reticle. The method includes applying ionized particles to the reticle by a discharging device. The method includes forming a photoresist layer over a semiconductor substrate. The method includes securing the semiconductor substrate by a wafer electrostatic-clamp. The method also includes patterning the photoresist layer by emitting radiation from a radiation source via the reticle.

Abstract: A server computer system has one or more node assemblies. A node assembly has two motherboards that are stacked one over another with their component sides facing toward each other. Memory cards that are mounted on one motherboard are interlaced with memory cards that are mounted on the other motherboard. At least processors of the two motherboards are immersed in a coolant fluid in a fluid immersion cooling tank. A processor cooling stack is mounted over a processor. The processor cooling stack includes flow regulation structures with sidewalls that regulate flow of vapor bubbles of the coolant fluid away from the processor.

Abstract: The present disclosure is related to electronic devices. At least some embodiments of the present disclosure relate to an electronic device comprising a circuit board, a first connector, and a second connector. The first connector and the second connector are disposed on the circuit board. The first connector is different from the second connector. The second connector is adjacent to the first connector. The first connector is arranged along a reference line in a first direction, and the second connector is adjacent to the reference line in the first direction.

Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Abstract: A system includes a support frame residing within a region conforming to a 3.5-inch form-factor disk drive specification, and a plurality of data storage drives, wherein each data storage drive resides entirely within the region. Each data storage drive conforms to a 2.5-inch form-factor disk drive specification, is mounted on the support frame via at least one external mounting hole that is positioned on a surface of the data storage drive in conformance with the 2.5-inch form-factor disk drive specification, is communicatively coupled to a backplane via an electrical connection device, and the electrical connection device includes a flexible electrical connector that, when coupled to a first end of the data storage drive, does not extend beyond the region, and has a removal tab through which a removal force is exerted to urge the data storage drive away from the support frame.

Abstract: The present disclosure is related to electronic devices. At least some embodiments of the present disclosure relate to an electronic device comprising a circuit board, a first connector, and a second connector. The first connector and the second connector are disposed on the circuit board. The first connector is different from the second connector. The second connector is adjacent to the first connector. The first connector is arranged along a reference line in a first direction, and the second connector is adjacent to the reference line in the first direction.

Abstract: An accommodating structure of data storage unit includes a carrier case formed by integrated injection molding. The carrier case is a plastic piece comprising a housing, a pair of elastic arms connected with the housing and a push block connected with the elastic arms. The housing has a receiving space, and the push block has a tab at a side away from the receiving space. Moreover, the present invention further provides an accommodating assembly of data storage unit. The components of the accommodating assembly are less and the structures are simple to enhance the convenience of assembly.

Abstract: A data storage device includes a tray, a circuit board module and two storage units. The tray has a carrying space. The circuit board module includes a circuit board, a pair of adapter slots and a connection slot. The pair of adapter slots are disposed with an interval at one side of the tray, and the storage units are arranged side by side in the carrying space. Each storage unit includes a carrying box and a storage component. The carrying box is pivoted with a handle, and two sides of the handle are pivoted at opposite sides of the carrying box so that the handle is capable of rotating above the carrying box. The storage component is inserted in the adapter slot to electrically connect with the circuit board.

Abstract: A data storage device includes a tray, a circuit board module and two storage units. The tray has a carrying space. The circuit board module includes a circuit board, a pair of adapter slots and a connection slot. The pair of adapter slots are disposed with an interval at one side of the tray, and the storage units are arranged side by side in the carrying space. Each storage unit includes a carrying box and a storage component. The carrying box is pivoted with a handle, and two sides of the handle are pivoted at opposite sides of the carrying box so that the handle is capable of rotating above the carrying box. The storage component is inserted in the adapter slot to electrically connect with the circuit board.

Abstract: A test method for a transmit port of storage devices of a system host, the system host includes a computing module, and the test method includes the steps of: coupling a test storage device to the transmit port of the computing module, wherein the test storage device includes a controller and a cache unit; providing, by the computing module, data to the test storage device through the transmit port to perform a storage testing mode; writing, by the controller, the data to the cache unit to complete the write operation, and then stops the write operation to complete the storage test; reading, by the computing module, the data provided from the test storage device for the computing module requested, performing a reading testing mode, and the controller only transmit the data from the cache unit to the computing module to complete a reading test.

Abstract: A data storage module includes an adapter and at least two data storage units. The adapter includes a hybrid port and at least two transmit ports coupled to the hybrid port, and the hybrid port is a hybrid U.2 transmission interface compatible with transmission protocols of SATA, SAS, and NVMe. Each of the data storage units has a transmission protocol different from that of other data storage units and coupling one of the compatible transmit ports according to a defined transmission protocol. A system host communicates for data storage or data access with each of the data storage units through the hybrid port and each of the transmit ports correspondingly coupled to each of the data storage units in the meantime.

Abstract: A composite cable assembly includes flat cables, a cable unit and fastening units. Each flat cable includes conductor assemblies and a shielding layer covering the conductor assemblies. The cable unit includes transmission lines. The transmission lines are arranged horizontally and in contact with the shielding layer of the flat cable closest to the transmission lines. The cable unit contacts the flat cable closest to the cable unit, the cable unit and each flat cable are together bent to form bent portions and extension sections connected to the bent portions. Each two fastening units are arranged spaced apart at two sides of a corresponding bent portion. Each extension section has the same length when the cable unit and each flat cable are moved in a movement direction to extend or collapse.

Abstract: A composite cable assembly includes flat cables, a cable unit and fastening units. Each flat cable includes conductor assemblies and a shielding layer covering the conductor assemblies. The cable unit includes transmission lines. The transmission lines are arranged horizontally and in contact with the shielding layer of the flat cable closest to the transmission lines. The cable unit contacts the flat cable closest to the cable unit, the cable unit and each flat cable are together bent to form bent portions and extension sections connected to the bent portions. Each two fastening units are arranged spaced apart at two sides of a corresponding bent portion. Each extension section has the same length when the cable unit and each flat cable are moved in a movement direction to extend or collapse.

Abstract: A system includes a support frame residing within a region conforming to a 3.5-inch form-factor disk drive specification, and a plurality of data storage drives, wherein each data storage drive resides entirely within the region. Each data storage drive conforms to a 2.5-inch form-factor disk drive specification, is mounted on the support frame via at least one external mounting hole that is positioned on a surface of the data storage drive in conformance with the 2.5-inch form-factor disk drive specification, is communicatively coupled to a backplane via an electrical connection device, and the electrical connection device includes a flexible electrical connector that, when coupled to a first end of the data storage drive, does not extend beyond the region, and has a removal tab through which a removal force is exerted to urge the data storage drive away from the support frame.

Abstract: An electrical connector includes a housing and a plurality of terminal wafers. The housing is formed with a plurality of terminal slots along a traverse direction. The terminal wafers are contiguous to each other and retained in the housing. Each terminal wafer has a first terminal, a second terminal and a packaging body. The first terminal has a first contacting section, a first soldering portion and a first embedded section. The second terminal has a second contacting section, a second soldering portion and a second embedded section. The first and second contacting sections are extended along a plugging direction into one corresponding terminal slot. The packaging body wraps the first and second embedded sections. A curve contour of the first embedded section is corresponded to a curve contour of the second embedded section, so that an attachment relationship is configured with substantial identical distance therebetween.

Abstract: An electrical connector includes a housing and a plurality of terminal wafers. The housing is formed with a plurality of terminal slots along a traverse direction. The terminal wafers are contiguous to each other and retained in the housing. Each terminal wafer has a first terminal, a second terminal and a packaging body. The first terminal has a first contacting section, a first soldering portion and a first embedded section. The second terminal has a second contacting section, a second soldering portion and a second embedded section. The first and second contacting sections are extended along a plugging direction into one corresponding terminal slot. The packaging body wraps the first and second embedded sections. A curve contour of the first embedded section is corresponded to a curve contour of the second embedded section, so that an attachment relationship is configured with substantial identical distance therebetween.

Abstract: A docking device with telephone exchange function includes a docking base for placement of and for coupling with a mobile phone, a telephone communication interface for coupling with a landline telephone set and to receive a dialing signal therefrom, a processor to receive an incoming call signal from the mobile phone, and an exchange module converting the incoming call signal into an analog incoming call signal to be outputted to the landline telephone set such that an incoming call may be answered. The exchange module further converts the dialing signal into a digital dialing signal and the processor converts the digital dialing signal into a converted digital dialing signal compatible in format with and to be outputted to the mobile phone for making a mobile phone call.

Abstract: The invention provides a conjugated diene-vinyl aromatic hydrocarbon copolymer containing a siloxane compound, which improves the abrasion resistance of the conjugated diene-vinyl aromatic hydrocarbon copolymer, comprising: 100 parts by weight of the conjugated diene-vinyl aromatic hydrocarbon copolymer and 0.1 to 50 parts by weight of the siloxane compound. The siloxane compound of the invention has a formula (I) as below: wherein each X independently represents C1˜C12 alkyl, C1˜C12 alkoxy, C1˜C12 cycloalkoxy, C1˜C12 alkenyl, C1˜C12 alkylamino, C1˜C12 alkylol, C1˜C12 thiol, halogen, carboxyl, hydroxyl, amino, aryl, or hydrogen; each Y independently represents C1˜C12 alkyl, C1˜C12 alkoxy, C1˜C12 cycloalkoxy, C1˜C12 alkenyl, C1˜C12 alkylamino, C1˜C12 alkylol, C1˜C12 thiol, halogen, carboxyl, aryl, or hydrogen; and n is an integer between 5 and 10,000.