Abstract: A fan structure includes a first fixing ring and a plurality of fan blades. The first fixing ring includes a plurality of first recesses radially arranged on the first fixing ring. One side of the fan blades is coupled to the first recesses of the first fixing ring. The first fixing ring includes a stamped part and a non-stamped part, in which the stamped part is in contact with the fan blades, and the thickness of the stamped part is smaller to the thickness of the non-stamped part.

Abstract: A fan structure includes a first fixing ring and a plurality of fan blades. The first fixing ring includes a plurality of first recesses radially arranged on the first fixing ring. One side of the fan blades is coupled to the first recesses of the first fixing ring. The first fixing ring includes a stamped part and a non-stamped part, in which the stamped part is in contact with the fan blades, and the thickness of the stamped part is smaller to the thickness of the non-stamped part.

Abstract: A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.

Abstract: A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.

Abstract: An electronic device and a temperature modulation method are disclosed herein. The electronic device includes a system body, a heat pipe module, a fan module, an orientation sensor, a temperature sensor and a control module. The system body includes an electronic component. The heat pipe module is connected to the electronic component. The fan module is installed in the system body. The orientation sensor can detect an orientation of the system body and output an orientation-sensing signal based on the orientation. The temperature sensor can detect a temperature of the heat pipe module and output a temperature-sensing signal based on the temperature. The control module can control rotation of the fan module according to at least one of the orientation-sensing signal and the temperature-sensing signal.