Patents by Inventor Hsiao-Han Lin

Hsiao-Han Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12213303
    Abstract: The present disclosure provides a semiconductor device and a fabricating method thereof, and which includes a substrate, bit lines, bit line contacts, a gate structure, a first oxidized interface layer, and a second oxidized interface layer. The bit lines are disposed on the substrate, and the bit line contacts are disposed below the bit lines. The gate structure is disposed on the substrate, wherein each bit line and the gate structure respectively include a semiconductor layer, a conductive layer, and a covering layer stacked from bottom to top. The first oxidized interface layer is disposed between each bit line contact and the semiconductor layer of each bit line. The second oxidized interface layer is disposed within the semiconductor layer of the gate structure, wherein a topmost surface of the first oxidized interface layer is higher than a topmost surface of the second oxidized interface layer.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 28, 2025
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Yukihiro Nagai, Lu-Yung Lin, Chia-Wei Wu, Tsun-Min Cheng, Yu Chun Lin, Zheng Guo Zhang, Sun-Hung Chen, Wu Xiang Li, Hsiao-Han Lin
  • Publication number: 20230284436
    Abstract: The present disclosure provides a semiconductor device and a fabricating method thereof, and which includes a substrate, bit lines, bit line contacts, a gate structure, a first oxidized interface layer, and a second oxidized interface layer. The bit lines are disposed on the substrate, and the bit line contacts are disposed below the bit lines. The gate structure is disposed on the substrate, wherein each bit line and the gate structure respectively include a semiconductor layer, a conductive layer, and a covering layer stacked from bottom to top. The first oxidized interface layer is disposed between each bit line contact and the semiconductor layer of each bit line. The second oxidized interface layer is disposed within the semiconductor layer of the gate structure, wherein a topmost surface of the first oxidized interface layer is higher than a topmost surface of the second oxidized interface layer.
    Type: Application
    Filed: April 21, 2022
    Publication date: September 7, 2023
    Applicant: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Yukihiro Nagai, Lu-Yung Lin, Chia-Wei Wu, Tsun-Min Cheng, Yu Chun Lin, Zheng Guo Zhang, Sun-Hung Chen, Wu Xiang Li, Hsiao-Han Lin
  • Patent number: 10501529
    Abstract: Provided herein are a mutant envelope protein of Zika virus and a nucleic acid molecule including a nucleotide sequence encoding the mutant envelope protein. The mutant envelope protein, which preferably has a threonine substitution at 105th position, or an asparagine substitution at 248th position and a threonine substitution at 250th position in an amino acid sequence of SEQ ID NO: 1, includes an N-glycan masking a fusion loop region of the mutant envelope protein of Zika virus. Also provided herein is a vaccine composition, including the mutant envelope protein or a recombinant virus including the nucleic acid molecule. Also provided herein is a method of preventing Zika virus infection and reducing antibody-dependent enhancement of dengue virus infection, including administering to a subject in need thereof an effective amount of a vaccine composition including the mutant envelope protein of Zika virus.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: December 10, 2019
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Suh-Chin Wu, Shao-Ping Yang, Hsiao-Han Lin
  • Publication number: 20190248875
    Abstract: Provided herein are a mutant envelope protein of Zika virus and a nucleic acid molecule including a nucleotide sequence encoding the mutant envelope protein. The mutant envelope protein, which preferably has a threonine substitution at 105th position, or an asparagine substitution at 248th position and a threonine substitution at 250th position in an amino acid sequence of SEQ ID NO: 1, includes an N-glycan masking a fusion loop region of the mutant envelope protein of Zika virus. Also provided herein is a vaccine composition, including the mutant envelope protein or a recombinant virus including the nucleic acid molecule. Also provided herein is a method of preventing Zika virus infection and reducing antibody-dependent enhancement of dengue virus infection, including administering to a subject in need thereof an effective amount of a vaccine composition including the mutant envelope protein of Zika virus.
    Type: Application
    Filed: July 17, 2018
    Publication date: August 15, 2019
    Inventors: Suh-Chin Wu, Shao-Ping Yang, Hsiao-Han Lin
  • Patent number: 10124054
    Abstract: Provided is a vaccine combination against multiple dengue virus serotypes and preparation thereof. The vaccine combination includes a first vaccine and a second vaccine, wherein the first vaccine includes a live-attenuated dengue virus and a live-attenuated chimeric dengue virus, and the second vaccine includes a plurality type of recombinant flagellin and envelope domain III fusion proteins, wherein an envelope domain III of each type of the recombinant flagellin and envelope domain III fusion proteins is derived from a different dengue virus serotype. Also provided is a method of preventing or treating viral infection by multiple dengue virus serotypes in a subject using the vaccine combination, including the steps of administering the first and then the second vaccines at a time interval of about 1-5 weeks.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: November 13, 2018
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Suh-Chin Wu, Hsiao-Han Lin, Meng-Ju Tsai, Guan-Cheng Lin
  • Publication number: 20180133302
    Abstract: Provided is a vaccine combination against multiple dengue virus serotypes and preparation thereof. The vaccine combination includes a first vaccine and a second vaccine, wherein the first vaccine includes a live-attenuated dengue virus and a live-attenuated chimeric dengue virus, and the second vaccine includes a plurality type of recombinant flagellin and envelope domain III fusion proteins, wherein an envelope domain III of each type of the recombinant flagellin and envelope domain III fusion proteins is derived from a different dengue virus serotype. Also provided is a method of preventing or treating viral infection by multiple dengue virus serotypes in a subject using the vaccine combination, including the steps of administering the first and then the second vaccines at a time interval of about 1-5 weeks.
    Type: Application
    Filed: April 24, 2017
    Publication date: May 17, 2018
    Inventors: SUH-CHIN WU, HSIAO-HAN LIN, MENG-JU TSAI, GUAN-CHENG LIN
  • Publication number: 20120269853
    Abstract: The present invention relates to an attenuated dengue virus vaccine. In present invention, target mutagenesis at Glu345Lys was constructed in two infectious cDNA clones of a recombinant version of wild type virus DEN-4 2A and its derived 3? NCR deletion mutant vaccine candidate virus DEN-4 2A?30. Using PCR-mediated site-directed mutagenesis method, the infectious cDNA clone-derived Glu345-Lys mutants of DEN-4 2A and DEN-4 2A?30 were passaged in Vero cells and MRC-5 cells for five consecutive times. The results shows that single point mutation E-Glu345Lys of DEN-4 2A and DEN-4 2A?30 were found stably existed when passaged in MRC-5 cells, which means mutagenesis at Glu345Lys of DEN-4 2A and DEN-4 2A?30 are both suitable to be probagated in MRC-5 cell for producing virulence attenuated dengue virus vaccine.
    Type: Application
    Filed: April 20, 2011
    Publication date: October 25, 2012
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Suh-Chin Wu, Hsiang-Chi Lee, Hung-Ju Hsiao, Hsiao-Han Lin