Patents by Inventor Hsiao-Hu Peng
Hsiao-Hu Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11875921Abstract: A carbon nanotube (CNT) cable includes: a pair of plated twisted wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; a dielectric surrounding the plated twisted wires; and an electrical layer surrounding the dielectric, the electrical layer configured to shield the CNT cable. A method for making a CNT cable includes: controlling a deposition rate, depositing plating so as to surround a pair of wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; twisting the plated wires together; and surrounding the plated twisted wires with an electrical layer configured to shield the plated twisted wires, thereby creating the CNT cable.Type: GrantFiled: September 25, 2018Date of Patent: January 16, 2024Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Bradley J. Lyon, Nana Kim, Hsiao-Hu Peng, John A. Starkovich, Edward M. Silverman
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Patent number: 10923716Abstract: A hybrid electrode and an energy storage device are disclosed. The hybrid electrode is applicable to use in advanced rechargeable energy storage and power sources. A non-woven sheet of carbon-nanotubes (CNTs) and a layer of lithiated graphene nanoparticles deposited on the sheet of CNTs are provided.Type: GrantFiled: March 6, 2020Date of Patent: February 16, 2021Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 10637046Abstract: A graphene-carbon nanotube hybrid electrode material and a method of manufacture are disclosed. The hybrid nanostructured electrode is applicable to use in advanced rechargeable energy storage and power sources. Thin hybrid anodes consisting of doped, low electrical resistivity, well-interconnected CNT sheet material with deposited high defect structure graphene nanoparticles provide a battery with high specific energy battery and pulse power capabilities.Type: GrantFiled: May 12, 2017Date of Patent: April 28, 2020Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 10584418Abstract: A method for creating a randomly-oriented, non-woven carbon nanotube (CNT) sheet with reduced reflectance includes: providing a randomly-oriented, non-woven CNT sheet; and performing plasma treatment of the randomly-oriented, non-woven CNT sheet, thereby creating a randomly-oriented, non-woven CNT sheet with reduced reflectance.Type: GrantFiled: February 23, 2017Date of Patent: March 10, 2020Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: John A. Starkovich, Edward M. Silverman, Hsiao-Hu Peng
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Publication number: 20190122788Abstract: A carbon nanotube (CNT) cable includes: a pair of plated twisted wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; a dielectric surrounding the plated twisted wires; and an electrical layer surrounding the dielectric, the electrical layer configured to shield the CNT cable. A method for making a CNT cable includes: controlling a deposition rate, depositing plating so as to surround a pair of wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; twisting the plated wires together; and surrounding the plated twisted wires with an electrical layer configured to shield the plated twisted wires, thereby creating the CNT cable.Type: ApplicationFiled: September 25, 2018Publication date: April 25, 2019Inventors: Bradley J. Lyon, Nana Kim, Hsiao-Hu Peng, John A. Starkovich, Edward M. Silverman
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Patent number: 10182493Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.Type: GrantFiled: June 27, 2017Date of Patent: January 15, 2019Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Xianglin Zeng, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 10180288Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: GrantFiled: February 2, 2017Date of Patent: January 15, 2019Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Patent number: 10128022Abstract: A carbon nanotube (CNT) cable includes a pair of plated twisted wires, wherein each wire includes one or more sub-cores, wherein at least one sub-core includes CNT yarn; a dielectric surrounding the plated twisted wires; and an electrical layer surrounding the dielectric, wherein the electrical layer is configured to shield the CNT cable. A method for making a CNT cable includes the steps of controlling a deposition rate, depositing plating so as to surround a pair of wires, wherein each wire includes one or more sub-cores, wherein at least one sub-core includes CNT yarn, twisting the plated wires together, and surrounding the plated twisted wires with an electrical layer configured to shield the plated twisted wires, thereby creating the CNT cable.Type: GrantFiled: October 24, 2017Date of Patent: November 13, 2018Assignee: Northrop Grumman Systems CorporationInventors: Bradley J. Lyon, Nana Kim, Hsiao-Hu Peng, John A. Starkovich, Edward M. Silverman
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Publication number: 20180206328Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.Type: ApplicationFiled: June 27, 2017Publication date: July 19, 2018Inventors: John A. Starkovich, Jesse B. Tice, Xianglin Zeng, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 9920178Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.Type: GrantFiled: December 11, 2015Date of Patent: March 20, 2018Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Patent number: 9810820Abstract: A method for manufacturing optical and microwave reflectors includes: placing an assembly comprising a resin-infiltrated tendrillar mat structure on a mandrel; placing a pre-impregnated carbon fiber (CF) lamina on top of the tendrillar mat structure; placing the assembly in a vacuum device so as to squeeze out excess resin; and placing the assembly in a heating device so as to cure the tendrillar mat structure together with the CF lamina, forming the CF laminae into a laminate that combines with the tendrillar mat structure to create a cured assembly. A reflector suitable for one or more of optical and microwave applications includes: a mandrel; a resin-infiltrated tendrillar mat structure placed on the mandrel; and a pre-impregnated carbon fiber (CF) lamina placed on top of the tendrillar mat structure.Type: GrantFiled: September 8, 2016Date of Patent: November 7, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 9741636Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.Type: GrantFiled: September 20, 2016Date of Patent: August 22, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Patent number: 9736923Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.Type: GrantFiled: January 17, 2017Date of Patent: August 15, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Xianglin Zeng, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 9688827Abstract: A method for infusing a nanoporous tendrillar mat with resin includes: performing a short duration, elevated temperature, pre-cure contacting treatment of the tendrillar mat using resin, thereby substantially uniformly infusing the tendrillar mat with resin; and curing the resin-infused tendrillar mat.Type: GrantFiled: August 29, 2016Date of Patent: June 27, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
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Publication number: 20170166721Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.Type: ApplicationFiled: December 11, 2015Publication date: June 15, 2017Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Publication number: 20170146302Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material: placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: ApplicationFiled: February 2, 2017Publication date: May 25, 2017Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Patent number: 9613882Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.Type: GrantFiled: September 19, 2016Date of Patent: April 4, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Patent number: 9601452Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: GrantFiled: August 29, 2016Date of Patent: March 21, 2017Assignees: Northrup Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior UniversityInventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Publication number: 20170005026Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.Type: ApplicationFiled: September 19, 2016Publication date: January 5, 2017Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Publication number: 20160372438Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: ApplicationFiled: August 29, 2016Publication date: December 22, 2016Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson